Y. Sakamoto , S. Ishihara , K. Masuda , W. Yamazaki , M. Shimura
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引用次数: 0
摘要
在锡/铜电镀过程中,由于金属间化合物(IMC)在锡/铜界面和锡晶界的形成,会形成晶须。以前的许多研究都侧重于晶须形成的机理以及晶须密度随时间的变化。然而,只有少数研究关注 IMC 的形成和生长行为,以及 IMC 和晶须之间的相关性。此外,还没有研究使用数学公式对 IMC 和晶须的形成和生长行为随时间的变化进行定量研究。本研究将锡/铜电镀应用于 7-3 黄铜基底,研究了锡/铜界面上 IMC 的形成和生长以及晶须的形成行为。根据反应动力学推导出了一个近似方程,以定量表示这两个参数随时间的变化。在 IMC 和晶须的形成行为之间观察到三个不同点。首先,IMC 的形成没有孵育时间 tth,而晶须的形成有孵育时间 tth。其次,晶须密度在 t = 10 d 前一直在增加,然后达到饱和。然而,IMC 密度在 t = 70 d 前一直在增加,然后趋于饱和。第三,横截面上的 IMC 密度是晶须密度的 7-10 倍,IMC 的速率常数小于晶须的速率常数。
Study on changes in intermetallic compounds and whisker formation over time in Sn/Cu plating
In Sn/Cu plating, whiskers are formed because of the formation of intermetallic compounds (IMCs) at the Sn/Cu interface and along the Sn grain boundaries. Many previous studies have focused on the mechanism of whisker formation and the change in whisker density over time. However, only a few studies have focused on the formation and growth behavior of IMCs and the correlation between IMCs and whiskers. Furthermore, no studies have quantitatively investigated the time-dependent changes in the formation and growth behavior of IMCs and whiskers using mathematical formulas. In this study, Sn/Cu plating was applied to a 7–3 brass substrate, and the formation and growth of IMCs at the Sn/Cu interface and the behavior of whisker formation were studied. An approximate equation was derived based on the reaction kinetics to quantitatively express the time-dependent changes in both parameters. Three differences were observed between the formation behaviors of IMCs and whiskers. First, no incubation time tth was observed for IMC formation, but it was for whiskers. Second, the whisker density increased until t = 10 d and then saturated. However, the IMC density increased until t = 70 d and then became saturated. Third, the IMC density in the cross section is 7–10 times higher than the whisker density, and the rate constant of the IMCs is smaller than that of the whiskers.
期刊介绍:
Materialia is a multidisciplinary journal of materials science and engineering that publishes original peer-reviewed research articles. Articles in Materialia advance the understanding of the relationship between processing, structure, property, and function of materials.
Materialia publishes full-length research articles, review articles, and letters (short communications). In addition to receiving direct submissions, Materialia also accepts transfers from Acta Materialia, Inc. partner journals. Materialia offers authors the choice to publish on an open access model (with author fee), or on a subscription model (with no author fee).