线弧快速成型 Inconel 625 合金的微结构演变、结晶纹理、晶粒形态和机械完整性

IF 4.8 2区 材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING Materials Characterization Pub Date : 2024-11-06 DOI:10.1016/j.matchar.2024.114525
Gaurav Kishor , Krishna Kishore Mugada , Raju Prasad Mahto , Aravindan Sivanandam , Ravi Kumar Digavalli , Murugaiyan Amirthalingam
{"title":"线弧快速成型 Inconel 625 合金的微结构演变、结晶纹理、晶粒形态和机械完整性","authors":"Gaurav Kishor ,&nbsp;Krishna Kishore Mugada ,&nbsp;Raju Prasad Mahto ,&nbsp;Aravindan Sivanandam ,&nbsp;Ravi Kumar Digavalli ,&nbsp;Murugaiyan Amirthalingam","doi":"10.1016/j.matchar.2024.114525","DOIUrl":null,"url":null,"abstract":"<div><div>The material in wire arc additive manufacturing (WAAM) undergoes complex material flow and multiple thermal heating and cooling cycles, forming highly heterogeneous microstructures in terms of size, crystallographic orientations, and mechanical properties. The inhomogeneity also depends on the dislocation density and phases, which are influenced by the thermal history of the process. In this study, the Cold Metal Transfer (CMT) process was used to deposit a 60-layer build of Inconel 625 alloy. Detailed variations in the microstructural size, orientations, and phases along the building direction were studied using optical microscopy, electron backscatter diffraction (EBSD), and X-ray diffraction (XRD). Microstructural observations reveal dendrites, equiaxed crystals, cellular, and columnar structures with primary and secondary dendrites. Dynamic recrystallization (DRX) followed by abnormal grain growth was found in the build. The average grain size varies with deposited height, with a grain size of around 13 ± 1 μm near the substrate, 45 ± 1 μm in the middle region, and 18 ± 1 μm at the top. The top region exhibited a strong intensity of recrystallized Cube, Cube-ND, and Cube-RD textures, with weaker intensities of copper and brass textures. The middle and bottom regions show strong intensities of Goss, copper, F, S, and E textures, respectively. The highest dislocation density of 5.122 × 10<sup>−4</sup> nm<sup>−2</sup> was found in the top region, while the lowest (4.14 × 10<sup>−4</sup> nm<sup>−2</sup>) was observed in the bottom region. The ultimate tensile strength of the build ranged from 603 ± 05 MPa to 699 ± 10 MPa, while the yield strength varied from 313 ± 07 MPa to 365 ± 08 MPa along different orientations. Vickers hardness results showed a slight variation, from 240 ± 5 to 260 ± 2 HV, from bottom to the top of the deposited build. The findings from this study provide valuable insights into the microstructural evolution mechanism and mechanical behavior of WAAM-fabricated Inconel 625, which can guide other researchers in optimizing process parameters, enhancing material properties, and understanding the effects of thermal history on additive manufacturing of high-performance alloys.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"218 ","pages":"Article 114525"},"PeriodicalIF":4.8000,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructural evolution, crystallographic texture, grain morphology, and mechanical integrity of wire arc additively manufactured Inconel 625 alloy\",\"authors\":\"Gaurav Kishor ,&nbsp;Krishna Kishore Mugada ,&nbsp;Raju Prasad Mahto ,&nbsp;Aravindan Sivanandam ,&nbsp;Ravi Kumar Digavalli ,&nbsp;Murugaiyan Amirthalingam\",\"doi\":\"10.1016/j.matchar.2024.114525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The material in wire arc additive manufacturing (WAAM) undergoes complex material flow and multiple thermal heating and cooling cycles, forming highly heterogeneous microstructures in terms of size, crystallographic orientations, and mechanical properties. The inhomogeneity also depends on the dislocation density and phases, which are influenced by the thermal history of the process. In this study, the Cold Metal Transfer (CMT) process was used to deposit a 60-layer build of Inconel 625 alloy. Detailed variations in the microstructural size, orientations, and phases along the building direction were studied using optical microscopy, electron backscatter diffraction (EBSD), and X-ray diffraction (XRD). Microstructural observations reveal dendrites, equiaxed crystals, cellular, and columnar structures with primary and secondary dendrites. Dynamic recrystallization (DRX) followed by abnormal grain growth was found in the build. The average grain size varies with deposited height, with a grain size of around 13 ± 1 μm near the substrate, 45 ± 1 μm in the middle region, and 18 ± 1 μm at the top. The top region exhibited a strong intensity of recrystallized Cube, Cube-ND, and Cube-RD textures, with weaker intensities of copper and brass textures. The middle and bottom regions show strong intensities of Goss, copper, F, S, and E textures, respectively. The highest dislocation density of 5.122 × 10<sup>−4</sup> nm<sup>−2</sup> was found in the top region, while the lowest (4.14 × 10<sup>−4</sup> nm<sup>−2</sup>) was observed in the bottom region. The ultimate tensile strength of the build ranged from 603 ± 05 MPa to 699 ± 10 MPa, while the yield strength varied from 313 ± 07 MPa to 365 ± 08 MPa along different orientations. Vickers hardness results showed a slight variation, from 240 ± 5 to 260 ± 2 HV, from bottom to the top of the deposited build. The findings from this study provide valuable insights into the microstructural evolution mechanism and mechanical behavior of WAAM-fabricated Inconel 625, which can guide other researchers in optimizing process parameters, enhancing material properties, and understanding the effects of thermal history on additive manufacturing of high-performance alloys.</div></div>\",\"PeriodicalId\":18727,\"journal\":{\"name\":\"Materials Characterization\",\"volume\":\"218 \",\"pages\":\"Article 114525\"},\"PeriodicalIF\":4.8000,\"publicationDate\":\"2024-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Characterization\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1044580324009069\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580324009069","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 0

摘要

线弧增材制造(WAAM)中的材料会经历复杂的材料流动和多次热加热与冷却循环,从而在尺寸、晶体取向和机械性能方面形成高度异质的微结构。这种不均匀性还取决于位错密度和相位,而位错密度和相位又受到工艺热历史的影响。本研究采用冷金属转移 (CMT) 工艺沉积了 60 层 Inconel 625 合金。使用光学显微镜、电子反向散射衍射 (EBSD) 和 X 射线衍射 (XRD) 对沿构建方向的微结构尺寸、取向和相位的详细变化进行了研究。微观结构观察结果显示了树枝状晶体、等轴晶、蜂窝状和柱状结构,以及一级和二级树枝状晶体。在构建过程中发现了动态再结晶(DRX)和异常晶粒生长。平均晶粒大小随沉积高度而变化,基底附近的晶粒大小约为 13 ± 1 μm,中间区域为 45 ± 1 μm,顶部为 18 ± 1 μm。顶部区域的再结晶立方体、立方体-ND 和立方体-RD 纹理强度较高,铜和黄铜纹理强度较弱。中间和底部区域分别显示出较强的 Goss、铜、F、S 和 E 纹理强度。顶部区域的位错密度最高,为 5.122 × 10-4 nm-2,而底部区域的位错密度最低(4.14 × 10-4 nm-2)。构建物的极限抗拉强度从 603 ± 05 兆帕到 699 ± 10 兆帕不等,而屈服强度沿不同方向从 313 ± 07 兆帕到 365 ± 08 兆帕不等。维氏硬度结果显示,从沉积构建体的底部到顶部,维氏硬度从 240 ± 5 HV 到 260 ± 2 HV 之间略有变化。本研究的结果为了解 WAAM 制成的 Inconel 625 的微观结构演变机制和机械性能提供了宝贵的见解,可指导其他研究人员优化工艺参数、提高材料性能以及了解热历史对高性能合金增材制造的影响。
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Microstructural evolution, crystallographic texture, grain morphology, and mechanical integrity of wire arc additively manufactured Inconel 625 alloy
The material in wire arc additive manufacturing (WAAM) undergoes complex material flow and multiple thermal heating and cooling cycles, forming highly heterogeneous microstructures in terms of size, crystallographic orientations, and mechanical properties. The inhomogeneity also depends on the dislocation density and phases, which are influenced by the thermal history of the process. In this study, the Cold Metal Transfer (CMT) process was used to deposit a 60-layer build of Inconel 625 alloy. Detailed variations in the microstructural size, orientations, and phases along the building direction were studied using optical microscopy, electron backscatter diffraction (EBSD), and X-ray diffraction (XRD). Microstructural observations reveal dendrites, equiaxed crystals, cellular, and columnar structures with primary and secondary dendrites. Dynamic recrystallization (DRX) followed by abnormal grain growth was found in the build. The average grain size varies with deposited height, with a grain size of around 13 ± 1 μm near the substrate, 45 ± 1 μm in the middle region, and 18 ± 1 μm at the top. The top region exhibited a strong intensity of recrystallized Cube, Cube-ND, and Cube-RD textures, with weaker intensities of copper and brass textures. The middle and bottom regions show strong intensities of Goss, copper, F, S, and E textures, respectively. The highest dislocation density of 5.122 × 10−4 nm−2 was found in the top region, while the lowest (4.14 × 10−4 nm−2) was observed in the bottom region. The ultimate tensile strength of the build ranged from 603 ± 05 MPa to 699 ± 10 MPa, while the yield strength varied from 313 ± 07 MPa to 365 ± 08 MPa along different orientations. Vickers hardness results showed a slight variation, from 240 ± 5 to 260 ± 2 HV, from bottom to the top of the deposited build. The findings from this study provide valuable insights into the microstructural evolution mechanism and mechanical behavior of WAAM-fabricated Inconel 625, which can guide other researchers in optimizing process parameters, enhancing material properties, and understanding the effects of thermal history on additive manufacturing of high-performance alloys.
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来源期刊
Materials Characterization
Materials Characterization 工程技术-材料科学:表征与测试
CiteScore
7.60
自引率
8.50%
发文量
746
审稿时长
36 days
期刊介绍: Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.
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