Evaluation of the developed and performance of epoxy resin bonding materials for steel bridge deck pavement layers

The deformation and stress coordination between steel bridge deck pavement (SBDP) were significantly affected by temperature and loading, which made it very prone to interlayer bonding disorders. In order to improve the interlayer bonding properties and service performance of SBDP, this study developed an epoxy asphalt and an epoxy resin, and evaluated the bonding characteristics and mechanical response characteristics of the adhesive layer materials based on performance tests and mechanical simulations. It was found that temperature had a significant effect on the pull-out and shear performance of the bonding layer. The pull-out and shear performance of epoxy asphalt were basically better than that of modified emulsified asphalt, and the pull-out performance could increase 2–3 times or more. Meanwhile, the developed epoxy resin waterproof bonding layer was significantly better than the high viscosity modified asphalt waterproof bonding layer. By performing the overall mechanical analysis, it was shown that the developed epoxy material shared more stress without changing the stress distribution in the SBDP bonding layer. The material could improve the bonding performance without significantly changing the interlayer stress, reduce the disease of SBDP structure, and improve the service life of SBDP. The research results could provide a theoretical basis for the development of high-performance SBDP.