高级半导体制造虚拟教学模块的开发及其学习效果分析

IF 2 3区 工程技术 Q3 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS Computer Applications in Engineering Education Pub Date : 2024-10-08 DOI:10.1002/cae.22802
Wernhuar Tarng, Jen-Kai Huang, Jen-Chu Shu, Yu-Hsuan Lin, Ting-Yun Chang, Hsin-Yu Jwo, Chun-Wei Tang
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引用次数: 0

摘要

半导体制造是制造半导体器件的过程,通常是集成电路(IC),如微处理器和存储器。这包括使用光掩膜和光刻胶将电路图转移到硅晶片上。经过一系列制造工序后,集成电路在硅片表面形成,然后切割成单个芯片,经过包装和质量控制程序测试,成为最终产品。虚拟现实(VR)通过人的感官和沉浸式设备模拟现实世界中难以实现的想象体验或环境,让用户在虚拟的三维空间中实时互动,非常适合应用于科学教育和工业培训。本研究将先进半导体制造工艺的基本知识转化为易于理解的虚拟教学模块,从而为高中生和大学生创造教育资源。这样做的目的是提高他们的科技素养,为公众带来实实在在的好处。本研究利用虚拟现实技术简化和阐明了半导体制造过程的相关知识,使学习者更容易接受。虚拟教学模块的学习内容包括晶圆制备、半导体制造、芯片封装和集成电路测试概述。用户可以与虚拟教学模块互动,进行虚拟实验,通过试错加深理解。实验结果表明,它可以提高学生的学习成绩和学习积极性。因此,虚拟教学模块适合中学生和普通大众了解半导体技术及其应用。虚拟教学模块的效果在很大程度上取决于 VR 硬件和软件的可用性和质量。先进的 VR 设备有限或技术问题可能会影响学习体验,从而影响学习成果。
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Development of a virtual teaching module for advanced semiconductor fabrication and its learning effectiveness analysis

Semiconductor fabrication is the process of manufacturing semiconductor devices, typically integrated circuits (ICs) such as microprocessors and memory. This involves transferring circuit diagrams onto a silicon wafer using photomasks and photoresists. After a series of fabrication processes, ICs are created on the wafer surface and then diced into individual chips, which are packaged and tested with quality control procedures to become the final products. Virtual reality (VR) simulates imaginary experiences or environments difficult to achieve in the real world through human senses and immersive equipment, allowing users to interact in a virtual 3D space in real time, making it well suited for applications in science education and industrial training. This study transforms the essential knowledge of advanced semiconductor manufacturing processes into an easily understandable virtual teaching module, thereby creating educational resources for high school and college students. The objective is to enhance their scientific and technological literacy, yielding substantial benefits for the general public. This study utilized VR technology to simplify and clarify the knowledge about the semiconductor manufacturing process, making it more engaging for learners. The virtual teaching module's learning content includes an overview of wafer preparation, semiconductor fabrication, chip packaging, and IC testing. Users can interact with the virtual teaching module and conduct virtual experiments to enhance their understanding by trial and error. Experimental results show that it can improve students' learning achievement and learning motivation. Therefore, the virtual teaching module is suitable for high-school students and the general public to understand semiconductor technology and its applications. The effectiveness of the virtual teaching module is heavily dependent on the availability and quality of VR hardware and software. Limited access to advanced VR equipment or technical issues could have affected the learning experience, thereby influencing the learning outcomes.

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来源期刊
Computer Applications in Engineering Education
Computer Applications in Engineering Education 工程技术-工程:综合
CiteScore
7.20
自引率
10.30%
发文量
100
审稿时长
6-12 weeks
期刊介绍: Computer Applications in Engineering Education provides a forum for publishing peer-reviewed timely information on the innovative uses of computers, Internet, and software tools in engineering education. Besides new courses and software tools, the CAE journal covers areas that support the integration of technology-based modules in the engineering curriculum and promotes discussion of the assessment and dissemination issues associated with these new implementation methods.
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