{"title":"含有巯基超支化聚硅氧烷的环氧树脂,具有理想的机械性能和较低的固化温度","authors":"Feifei Wang, Junyan Yao, Kaiming Yang, Bingrui Shi, Zhenlong Zhang, Weixu Feng, Hongxia Yan","doi":"10.1016/j.polymer.2024.127859","DOIUrl":null,"url":null,"abstract":"High-performance epoxy materials often necessitate curing at high-temperature, which can lead to defects, brittleness, deformation and processing difficulties. In this paper, the modifier sulfhydryl hyperbranched polysiloxane (HSiSH) was fabricated by the “one-pot” method. And investigated the effect of HSiSH on the curing temperature, mechanical and thermal properties of epoxy resin. The epoxy with the addition of 2.0 wt% HSiSH showcased superior comprehensive properties, including flexural strength of 159.37 MPa, impact strength of 24.77 kJ/m<sup>2</sup>, and tensile shear strength of 14.02 MPa, as well as the thermal properties are improved. Moreover, the presence of 2 wt% HSiSH can facilitate the curing process reducing the apparent activation energy by 12.25%. The highly branched topology, chain entanglement, \"rigid-flexible\" -Si-O-C- segment and active groups improve the strength and toughness of the material. Simultaneously, the numerous reactive groups within HSiSH actively participate in the curing reaction, thereby enhancing the adhesion between the resin and the substrate surface which increasing the bonding performance of the adhesive. This study lays a solid theoretical foundation for developing high-performance epoxy resins cured at lower and moderate temperatures.","PeriodicalId":405,"journal":{"name":"Polymer","volume":"99 1","pages":""},"PeriodicalIF":4.1000,"publicationDate":"2024-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Epoxy resins containing sulfhydryl hyperbranched polysiloxane with desirable mechanical properties and lower curing temperature\",\"authors\":\"Feifei Wang, Junyan Yao, Kaiming Yang, Bingrui Shi, Zhenlong Zhang, Weixu Feng, Hongxia Yan\",\"doi\":\"10.1016/j.polymer.2024.127859\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High-performance epoxy materials often necessitate curing at high-temperature, which can lead to defects, brittleness, deformation and processing difficulties. In this paper, the modifier sulfhydryl hyperbranched polysiloxane (HSiSH) was fabricated by the “one-pot” method. And investigated the effect of HSiSH on the curing temperature, mechanical and thermal properties of epoxy resin. The epoxy with the addition of 2.0 wt% HSiSH showcased superior comprehensive properties, including flexural strength of 159.37 MPa, impact strength of 24.77 kJ/m<sup>2</sup>, and tensile shear strength of 14.02 MPa, as well as the thermal properties are improved. Moreover, the presence of 2 wt% HSiSH can facilitate the curing process reducing the apparent activation energy by 12.25%. The highly branched topology, chain entanglement, \\\"rigid-flexible\\\" -Si-O-C- segment and active groups improve the strength and toughness of the material. Simultaneously, the numerous reactive groups within HSiSH actively participate in the curing reaction, thereby enhancing the adhesion between the resin and the substrate surface which increasing the bonding performance of the adhesive. This study lays a solid theoretical foundation for developing high-performance epoxy resins cured at lower and moderate temperatures.\",\"PeriodicalId\":405,\"journal\":{\"name\":\"Polymer\",\"volume\":\"99 1\",\"pages\":\"\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-11-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1016/j.polymer.2024.127859\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1016/j.polymer.2024.127859","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Epoxy resins containing sulfhydryl hyperbranched polysiloxane with desirable mechanical properties and lower curing temperature
High-performance epoxy materials often necessitate curing at high-temperature, which can lead to defects, brittleness, deformation and processing difficulties. In this paper, the modifier sulfhydryl hyperbranched polysiloxane (HSiSH) was fabricated by the “one-pot” method. And investigated the effect of HSiSH on the curing temperature, mechanical and thermal properties of epoxy resin. The epoxy with the addition of 2.0 wt% HSiSH showcased superior comprehensive properties, including flexural strength of 159.37 MPa, impact strength of 24.77 kJ/m2, and tensile shear strength of 14.02 MPa, as well as the thermal properties are improved. Moreover, the presence of 2 wt% HSiSH can facilitate the curing process reducing the apparent activation energy by 12.25%. The highly branched topology, chain entanglement, "rigid-flexible" -Si-O-C- segment and active groups improve the strength and toughness of the material. Simultaneously, the numerous reactive groups within HSiSH actively participate in the curing reaction, thereby enhancing the adhesion between the resin and the substrate surface which increasing the bonding performance of the adhesive. This study lays a solid theoretical foundation for developing high-performance epoxy resins cured at lower and moderate temperatures.
期刊介绍:
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.