高压下 WSi2 的物理性质和机械行为

IF 2.8 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Silicon Pub Date : 2024-10-16 DOI:10.1007/s12633-024-03169-4
Lun Xiong, Mingquan Jiang, Xin He, Sheng Jiang
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引用次数: 0

摘要

在这项研究中,我们使用同步辐射 X 射线衍射技术,以硅油为压力传输介质,在室温下的金刚石砧中研究了二硅化钨(WSi2)在 35.5 GPa 压力下的压缩行为。在研究的压力范围内,WSi2 没有发生结构相变。通过拟合不同压力下的体积数据,我们得出 WSi2 的体积模量为 289(3) GPa。此外,我们还利用基于第一性原理的密度泛函理论研究了 WSi2 在最高压力 40 GPa 下的体积模量、电子带结构和状态密度。理论计算表明,WSi2 的体积模量为 242 GPa。理论计算结果表明,在 0-40 GPa 的整个压力范围内,WSi2 都表现出半金属性和非磁性。
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Physical Properties and Mechanical Behavior of WSi2 at High Pressure

In this study, we studied the compression behavior of tungsten disilicide (WSi2) to 35.5 GPa using synchrotron radiation X-ray diffraction with silicon oil as the pressure transmission medium in a diamond anvil at room temperature. WSi2 did not undergo a structural phase transition within the pressure range studied. By fitting the volume data under different pressures, we obtained a bulk modulus of 289(3) GPa for WSi2. In addition, we studied the bulk modulus, electronic band structure, and density of states of WSi2 to the highest pressure of 40 GPa using density functional theory based on first-principles. The theoretical calculation shows that the bulk modulus of WSi2 is 242 GPa. The theoretical calculation results indicate that WSi2 exhibits both semimetallic and non-magnetic properties throughout the entire pressure range of 0–40 GPa.

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来源期刊
Silicon
Silicon CHEMISTRY, PHYSICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
5.90
自引率
20.60%
发文量
685
审稿时长
>12 weeks
期刊介绍: The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.
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