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Recent Advances in Ultra-High Voltage SiC Edge Termination Technology 超高压SiC边缘端接技术研究进展
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-12 DOI: 10.1007/s12633-025-03562-7
Baohua Tian, Feng He, Zhongyuan Chen, Cui Li, Ling Sang, Rui Jin

Silicon carbide (SiC) power devices exhibit significant potential in ultra-high voltage (UHV) power electronics applications due to their ability to simplify circuit topology and enhance energy conversion efficiency. The increasing demand for higher breakdown voltages has led to greater termination lengths and more complex structures. Therefore, termination technology has become a critical challenge in UHV SiC power devices. This paper discusses three crucial issues involved in UHV SiC termination technology, namely avalanche model, analytical method, and structure configuration. First, a comparative analysis of avalanche breakdown models is performed to elucidate the physical characteristics of SiC impact ionization coefficients. The identified model parameters provide a theoretical basis for predicting the breakdown voltage of SiC termination. Furthermore, two innovative models are proposed to facilitate the efficient design of termination configuration and reduce the complexity of structure traversal calculation in UHV termination: a multi-ring iterative model based on voltage superposition and a sector depletion model based on charge balance. Finally, the technical features of state-of-the-art UHV SiC terminations are analyzed to gain insight into the electric field modulation principles of various structure configurations. The design considerations are also discussed with a focus on the feasibility of different termination categories in UHV devices.

碳化硅(SiC)功率器件由于其简化电路拓扑和提高能量转换效率的能力,在超高压(UHV)电力电子应用中表现出巨大的潜力。对高击穿电压的需求日益增长,导致终端长度越来越长,结构越来越复杂。因此,终端技术已成为特高压SiC功率器件的关键挑战。本文讨论了超高压SiC端接技术中涉及到的雪崩模型、解析方法和结构配置三个关键问题。首先,对雪崩击穿模型进行了对比分析,阐明了碳化硅冲击电离系数的物理特性。所确定的模型参数为预测SiC端部击穿电压提供了理论依据。在此基础上,提出了基于电压叠加的多环迭代模型和基于电荷平衡的扇区耗尽模型,以促进特高压终端构型的高效设计,降低结构遍历计算的复杂性。最后,分析了最先进的特高压SiC端子的技术特点,以深入了解各种结构配置的电场调制原理。文中还讨论了设计考虑因素,重点讨论了在特高压器件中采用不同端接类别的可行性。
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引用次数: 0
BPNN-Based Strength Prediction of Single-Crystal Silicon at High Strain Rates 基于bpnn的单晶硅高应变速率强度预测
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-11 DOI: 10.1007/s12633-025-03544-9
Hao Li, Yeda Lian, Zhuobin Ma, Leike Yang, Jundong Wang, Lanjie Niu

Single-crystal silicon, a widely used substrate material for Micro-Electro-Mechanical Systems (MEMS), has been extensively studied for its quasi-static mechanical properties. However, data concerning its mechanical properties at high strain rates are scarce, and corresponding research is insufficient, thereby severely limiting the extended applications of silicon-based MEMS. This study first conducted three sets of high strain rate tests on single-crystal silicon using a Split Hopkinson pressure bar (SHPB) system to successfully acquire its dynamic stress–strain curves. Subsequently, the experimental results were utilized to calibrate and validate the finite element simulations performed in ABAQUS, ensuring the accuracy of the numerical modeling. Finally, a machine learning model based on a Backpropagation Neural Network (BPNN) was developed. This model utilizes the incident wave parameters from SHPB experiments as input features to predict the mechanical properties of single-crystal silicon at high strain rates. The results indicate that the developed BPNN-based machine learning prediction model exhibits excellent applicability. It can effectively circumvent the extensive and time-consuming processes of finite element simulation modeling, analysis, and post-processing. Furthermore, it accurately predicts the mechanical properties of single-crystal silicon at high strain rates and demonstrates the potential to extrapolate stress–strain curves to even higher strain rates. This research provides a valuable reference for subsequent work on establishing strain rate-dependent constitutive models for single-crystal silicon, optimizing the design of silicon-based MEMS structures, and expanding the applications of silicon-based MEMS.

单晶硅作为一种广泛应用于微机电系统(MEMS)的衬底材料,其准静态力学性能得到了广泛的研究。然而,关于其在高应变速率下的力学性能的数据很少,相应的研究也不足,从而严重限制了硅基MEMS的扩展应用。本研究首先利用分离式霍普金森压杆(Split Hopkinson pressure bar, SHPB)系统对单晶硅进行了三组高应变率测试,成功获得了单晶硅的动态应力-应变曲线。随后,利用实验结果对在ABAQUS中进行的有限元模拟进行校准和验证,确保数值模拟的准确性。最后,建立了基于反向传播神经网络(BPNN)的机器学习模型。该模型利用SHPB实验的入射波参数作为输入特征来预测单晶硅在高应变速率下的力学性能。结果表明,所建立的基于bpnn的机器学习预测模型具有良好的适用性。它可以有效地规避有限元仿真建模、分析和后处理的广泛而耗时的过程。此外,它准确地预测了单晶硅在高应变率下的力学性能,并证明了在更高应变率下推断应力-应变曲线的潜力。该研究为后续建立单晶硅应变速率相关的本构模型、优化硅基MEMS结构设计、拓展硅基MEMS应用等工作提供了有价值的参考。
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引用次数: 0
Analytical Modeling of Coupled Photothermal, Elastic, and Plasma Waves in Semiconductors under GNII Theory 基于GNII理论的半导体中光热、弹性和等离子体耦合波的解析建模
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-10 DOI: 10.1007/s12633-025-03516-z
Ibrahim Abbas, Areej Almuneef, Alaa A. El-Bary, Zuhur Alqahtani, Hamid M. Sedighi

This study presents a novel analytical and numerical framework for exploring the coupled photothermal, elastic, and plasma wave interactions in semiconductor materials under the GNII model, providing explicit solutions that capture the complex interplay of thermal, elastic, and carrier dynamics without energy dissipation. Specifically, the model addresses the interaction of thermo-elastic waves with plasma effects when subjected to high-intensity laser irradiation. The analytical solutions for these complex phenomena were derived using an eigenvalue approach combined with Laplace transform methods, providing explicit and precise formulations in transformed domains. Numerical inversion of these analytical solutions enabled detailed observation and analysis within the time domain. Comprehensive numerical computations were conducted using silicon-like semiconductor media to validate the model and explore the interplay among thermal, elastic, and plasma responses under varying laser intensities. The distribution of field quantities is significantly impacted by the photo-generated carrier lifetime and pulse rise time, which is a significant phenomenon, according to the graphical data.

本研究提出了一个新的分析和数值框架,用于在GNII模型下探索半导体材料中耦合的光热、弹性和等离子体波相互作用,提供了明确的解决方案,可以在没有能量耗散的情况下捕获热、弹性和载流子动力学的复杂相互作用。具体来说,该模型解决了在高强度激光照射下热弹性波与等离子体效应的相互作用。利用特征值法结合拉普拉斯变换方法推导了这些复杂现象的解析解,在变换域内给出了明确而精确的表达式。对这些解析解进行数值反演,可以在时域内进行详细的观测和分析。利用类硅半导体介质进行了全面的数值计算来验证模型,并探索了不同激光强度下热响应、弹性响应和等离子体响应之间的相互作用。根据图形数据,光产生的载流子寿命和脉冲上升时间对场量的分布有显著影响,这是一个显著的现象。
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引用次数: 0
Advanced Rare-Earth Doped Bioactive Glasses: A Comprehensive Review on Structural, Biological, and Mechanical Improvements 先进稀土掺杂生物活性玻璃:结构、生物和机械改进的综合综述
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-10 DOI: 10.1007/s12633-025-03577-0
Amirhossein Moghanian, Sirus Safaee, Ahmet Akif Kızılkurtlu, Ramin Farmani

This review critically synthesizes recent advances in rare-earth element (REE) doped bioactive glasses (BAGs), focusing specifically on how Lanthanum (La), Dysprosium (Dy), Terbium (Tb), Holmium (Ho), Gadolinium (Gd), and Yttrium (Y) alter glass structure and thereby mechanical performance and biomedical function. Unlike previous reviews that emphasize either bioactivity or optical/magnetic properties alone, our manuscript integrates atomic-scale structural evidence, processing-dependent effects (melt-quench vs sol–gel), and in-vitro/in-vivo outcomes to link dopant chemistry with osteogenesis, antimicrobial activity, imaging functionality and mechanical reliability. We also discuss practical challenges for scale-up, safety and clinical translation, and propose targeted future research directions. This integrated perspective aims to guide design decisions for next-generation BAG scaffolds and implant coatings where combined mechanical robustness and therapeutic functionality are required.

Graphical Abstract

本文综述了稀土元素(REE)掺杂生物活性玻璃(BAGs)的最新进展,特别关注镧(La)、镝(Dy)、铽(Tb)、钬(Ho)、钆(Gd)和钇(Y)如何改变玻璃结构,从而改变机械性能和生物医学功能。不像以前的综述只强调生物活性或光学/磁性,我们的论文整合了原子尺度的结构证据、加工依赖效应(熔融猝灭vs溶胶-凝胶)和体外/体内结果,将掺杂剂化学与成骨、抗菌活性、成像功能和机械可靠性联系起来。我们还讨论了扩大规模、安全性和临床转化的实际挑战,并提出了有针对性的未来研究方向。这一综合观点旨在指导下一代BAG支架和植入物涂层的设计决策,这些支架和植入物涂层需要结合机械稳健性和治疗功能。图形抽象
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引用次数: 0
Numerical Modelling of Heavily Silicon-Doped Hole Blocking Heterostructures for Enhanced Performance of AlGaN-Based DUV-LEDs 重掺硅孔阻挡异质结构对提高藻类基duv - led性能的数值模拟
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-10 DOI: 10.1007/s12633-025-03573-4
Farid Munawwar Amir Fadhil, Mohammad Amirul Hairol Aman, Ahmad Fakhrurrazi Ahmad Noorden, Wan Hazman Danial, Suzairi Daud, Mahdi Bahadoran, Muhammad Luqman Mohd Napi

This paper investigates the influence of silicon dopant concentration on the performance of AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs). AlGaN-based DUV-LEDs are critical for applications like sterilization and water purification but face efficiency challenges due to carrier imbalance and material defects. The study focuses on optimizing the hole-blocking layer (HBL) doped with silicon (Si), as HBL design significantly impacts carrier mobility, carrier confinement, and radiative recombination. Using MATLAB's one-dimensional drift–diffusion charge control (1D-DDCC) software, the research examines dopant concentrations ranging from 1 × 1015 cm⁻3 to 1 × 1020 cm⁻3 in six different devices with three quantum wells. Simulations will analyse carrier density, current density, energy band diagrams, radiative recombination rate, electric field, current-voltage (IV) characteristic, quantum efficiencies, and luminescence to determine the optimal doping level that minimizes defects while maximizing efficiency. Expected outcomes include identifying a doping range that balances recombination rate and quantum efficiency, leading to enhanced DUV-LED efficiency and stability. These findings aim to advance sustainable ultraviolet technologies and set a benchmark for future semiconductor designs.

研究了硅掺杂浓度对gan基深紫外发光二极管(duv - led)性能的影响。海藻基duv - led对于灭菌和水净化等应用至关重要,但由于载流子不平衡和材料缺陷,其效率面临挑战。该研究的重点是优化掺杂硅的空穴阻挡层(HBL),因为HBL的设计显著影响载流子迁移率、载流子约束和辐射复合。使用MATLAB的一维漂移-扩散电荷控制(1D-DDCC)软件,研究人员在六个不同的设备上用三个量子井检查了1 × 1015 cm - 1 × 1020 cm - 3的掺杂物浓度。模拟将分析载流子密度、电流密度、能带图、辐射复合率、电场、电流-电压(IV)特性、量子效率和发光,以确定最小化缺陷同时最大化效率的最佳掺杂水平。预期的结果包括确定一个平衡复合率和量子效率的掺杂范围,从而提高DUV-LED的效率和稳定性。这些发现旨在推进可持续紫外线技术,并为未来的半导体设计设定基准。
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引用次数: 0
Investigation of EPI Plug Voids Impacts on Electrical Performance of 3D NAND EPI插塞空隙对3D NAND电性能影响的研究
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-09 DOI: 10.1007/s12633-025-03533-y
Dibyadrasta Sahoo, Ankit Gaurav, Mohd Ashraf Lone, Sanjeev Kumar Manhas

During vertical channel 3D NAND fabrication, plasma-induced damage creates surface defects, which lead to the formation of voids at different locations of the subsequently grown epi-plug. The void's location, especially near the edge of the substrate-epi plug, as well as in the side wall of the epi-plug, is more critical. The void at the edge of the substrate-epi plug increases Vth, SS, and Rch and reduces Ion, compared to no void. Voids along the sidewall of the epi-plug also significantly affect electrical performance. Further trap formation around the void degrades performance, increasing Vth, SS, and Rch while significantly reducing Ion compared to without trap. Traps around voids far from the GSL (Ground Select Line) similarly degrade performance as those near the GSL and epi-plug edge. We also investigated the effects of voids during program/erase characteristics. Our study emphasizes how the geometric location of voids and the distribution of surrounding traps influence the reliability and electrical performance of 3D NAND devices.

在垂直通道3D NAND制造过程中,等离子体诱导的损伤会产生表面缺陷,从而导致在随后生长的外接插头的不同位置形成空隙。孔洞的位置,尤其是靠近衬底-外延塞边缘的位置,以及外延塞侧壁的位置,更为关键。衬底-外延塞边缘的空隙增加了Vth、SS和Rch,减少了离子。沿外接插头侧壁的空隙也显著影响电气性能。在空隙周围进一步形成陷阱会降低性能,增加Vth, SS和Rch,同时与没有陷阱相比显着减少离子。远离GSL(接地选择线)的空隙周围的陷阱与靠近GSL和外接插头边缘的陷阱同样会降低性能。我们还研究了空白对程序/擦除特性的影响。我们的研究强调了空隙的几何位置和周围陷阱的分布如何影响3D NAND器件的可靠性和电性能。
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引用次数: 0
Fabrication and Characterisation of Zinc Oxide (ZnO) Grown on Porous Silicon (PSi) Substrate Using Different Techniques for Glucose Biosensor 用不同工艺在多孔硅(PSi)衬底上生长的氧化锌(ZnO)制备和表征葡萄糖生物传感器
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-09 DOI: 10.1007/s12633-025-03553-8
A. Sh. Hussein, Fatima Salem Obaid Al Jasmi, Mohammed H. Jawad, Mohanad Q. Fahem

This study investigates the structural and optical properties of zinc oxide (ZnO) thin films deposited on porous silicon (PSi) substrates using three different fabrication techniques: radio frequency (RF) sputtering, sol–gel spin coating, and thermal evaporation. Characterization was performed using X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM), and photoluminescence (PL) spectroscopy. All ZnO/PSi samples exhibited high-quality polycrystalline films with low defect densities. Among the methods used, the RF sputtering technique achieved the best electrochemical performance. The maximum current density (Jmax) and Michaelis–Menten constant (K_M) were found to be 570 μA and 680 μM (0.68 mM), respectively, demonstrating efficient enzyme immobilisation on the ZnO/PSi electrode surface and a strong affinity between the immobilised glucose (GOx) molecules and glucose molecules. Furthermore, the glucose biosensor demonstrated moderate sensitivity over the linear detection range (500 μM to 2000 μM), with a linear range slope (LRS) of 40 μA/cm2/μM, and a correlation coefficient (R2) of 0.9543.

本研究采用三种不同的制备技术:射频溅射、溶胶-凝胶自旋镀膜和热蒸发,研究了在多孔硅(PSi)衬底上沉积氧化锌(ZnO)薄膜的结构和光学性能。利用x射线衍射(XRD)、扫描电镜(SEM)、原子力显微镜(AFM)和光致发光(PL)光谱进行表征。所有ZnO/PSi样品均具有低缺陷密度的高质量多晶薄膜。其中,射频溅射技术的电化学性能最好。最大电流密度(Jmax)和Michaelis-Menten常数(K_M)分别为570 μA和680 μM (0.68 mM),表明酶在ZnO/PSi电极表面具有高效的固定化作用,且固定化葡萄糖(GOx)分子与葡萄糖分子具有较强的亲和性。在500 μM ~ 2000 μM的线性检测范围内,该传感器具有中等的灵敏度,线性范围斜率为40 μA/cm2/μM,相关系数R2为0.9543。
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引用次数: 0
Fabrication and Performance Assessment of Hot Water Conditioned Epoxy Composites Reinforced With Modified Mango Peel Nanofibers and Jackfruit Peel Powder 芒果皮改性纳米纤维与菠萝蜜粉增强热水固化环氧复合材料的制备及性能评价
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-09 DOI: 10.1007/s12633-025-03566-3
Manoj Kumar S, Mahendran G, Kaliappan S, Natrayan L, Mohamed Abbas S

This research examines the effects of hot water conditioning on mechanical, thermal conductivity, flammability, and water absorption behaviour of the epoxy based composites. Nanofibers was extracted from mango peel using the retting process, while jack fruit peel powder was utilized as filler materials. Both the fiber and filler were chemically treated using 3-Aminopropyltrimethoxysilane (silane coupling agent) to enhance the composites performance. The hot water conditioning was conducted at 50 °C for 15 days. The overall performance of the composites was noticeably affected by conditioning, with the hot water conditioned composites exhibiting slightly reduced mechanical values compared to the unaged ones. Among them, composite SP2 (containing 2 vol.% filler) had the maximum tensile strength (150 MPa), flexural strength (156 MPa), and impact strength (5.8 J). Conversely, the unconditioned composite containing 4 vol. % filler (SP3) exhibited the highest thermal conductivity (0.391 W/mK) and surface hardness value of 87 Shore-D.Hot water conditioned composite (SP6) showed the highest water absorption (6.2%) and the slowest flame propagation speed (7.86 mm/min). The failure mechanisms and surface morphology of the composites were analysed using scanning electron microscopy (SEM).These epoxy-based composites, reinforced with agro-waste fibers and fillers, with their improved mechanical, thermal, and flame-retardant properties, are suitable for applications in lightweight structural components, interior panels, thermal insulation, water-resistant construction materials, and other eco-friendly consumer goods.

本研究考察了热水处理对环氧基复合材料的机械性能、导热性、可燃性和吸水性能的影响。以芒果果皮粉为填料,采用凝缩法提取芒果果皮中的纳米纤维。采用3-氨基丙基三甲氧基硅烷(硅烷偶联剂)对纤维和填料进行化学处理,提高复合材料的性能。50℃热水调理15天。复合材料的整体性能明显受到调理的影响,与未老化的复合材料相比,热水调理的复合材料的力学值略有降低。其中,复合材料SP2(含2 vol.%填料)的最大抗拉强度为150 MPa,最大抗折强度为156 MPa,最大冲击强度为5.8 J。相反,含有4 vol. %填料(SP3)的复合材料的导热系数最高(0.391 W/mK),表面硬度值为87 Shore-D。热水条件复合材料(SP6)的吸水率最高(6.2%),火焰传播速度最慢(7.86 mm/min)。利用扫描电镜对复合材料的破坏机理和表面形貌进行了分析。这些环氧基复合材料由农业废弃物纤维和填料增强,具有改进的机械、热和阻燃性能,适用于轻质结构部件、内饰板、隔热、防水建筑材料和其他环保消费品。
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引用次数: 0
A Study on Unlocking the Pozzolanic Potential of Toughened Glass Waste Powder for Sustainable Cement Paste Development 释放钢化玻璃废粉的火山灰潜力促进水泥浆体可持续发展的研究
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-09 DOI: 10.1007/s12633-025-03557-4
Hariharan Surendran, Punitha Kumar Akhas

The escalating demand for sustainable construction materials has intensified the exploration of alternative binders to Portland cement aimed at reducing energy consumption and CO₂ emissions. Concurrently, the disposal of toughened glass waste (TGW) in landfills poses a growing environmental challenge. This study investigates the synergistic pozzolanic potential of toughened glass waste powder (TGWP) and fly ash (FA) in blended cement pastes, emphasizing their mechanical and microstructural evolution. Fly ash was incorporated to mitigate the high alkalinity of the cement matrix, thereby minimizing the chemical degradation of TGWP. Experimental evaluations encompassed flow characteristics, compressive strength, and advanced characterization techniques including X-ray diffraction (XRD), Fourier-transform infrared spectroscopy (FTIR), and field emission scanning electron microscopy (FESEM). Results demonstrated that the rheological properties were strongly influenced by the particle morphology and fineness of the supplementary materials. The optimum blend containing 15% TGWP and 15% FA achieved a 16.81% increase in compressive strength after 90 days, attributed to the delayed pozzolanic reactivity of TGWP. XRD confirmed reduced calcium hydroxide and enhanced calcium silicate hydrate (C–S–H) formation, while FTIR evidenced intensified Si–O and Al–O bonding. FESEM coupled with EDS analysis revealed a densified microstructure and formation of calcium–alumino–silicate–hydrate (C–A–S–H) phases, affirming the pozzolanic activity of TGWP. The integration of TGWP and FA in cementitious systems represents a promising pathway toward eco-efficient binders, offering a dual advantage of waste valorisation and carbon footprint reduction in the construction sector.

对可持续建筑材料的不断增长的需求,加强了对波特兰水泥的替代粘合剂的探索,旨在减少能源消耗和二氧化碳排放。同时,在垃圾填埋场处理钢化玻璃废料(TGW)对环境造成了越来越大的挑战。本文研究了钢化玻璃废粉(TGWP)和粉煤灰(FA)在混合水泥浆中的协同作用,重点研究了它们的力学和微观结构演变。掺入粉煤灰可以降低水泥基体的高碱度,从而最大限度地减少TGWP的化学降解。实验评估包括流动特性、抗压强度和先进的表征技术,包括x射线衍射(XRD)、傅里叶变换红外光谱(FTIR)和场发射扫描电子显微镜(FESEM)。结果表明,补料的颗粒形态和细度对其流变性能有很大影响。添加15% TGWP和15% FA的最佳共混物在90天后抗压强度提高了16.81%,这是由于TGWP的火山灰反应性延迟。XRD证实氢氧化钙还原,水合硅酸钙(C-S-H)生成增强,FTIR证实Si-O和Al-O键结增强。FESEM和EDS分析显示,TGWP具有致密的微观结构和钙铝硅酸盐水合物(C-A-S-H)相的形成,证实了TGWP的火山灰活性。TGWP和FA在胶凝系统中的整合代表了一条通往生态高效粘合剂的有希望的途径,在建筑行业提供了废物增值和碳足迹减少的双重优势。
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引用次数: 0
Quartz Sand Structure Change and Impurity Removal Behavior in HCl Gas Chlorination Over a Wide High-Temperature Range and its Mechanism 大高温范围HCl气氯化石英砂结构变化及除杂行为及其机理
IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Pub Date : 2025-12-09 DOI: 10.1007/s12633-025-03571-6
Hao Fu, Xiaotian Chen, Yuziyu Gui, Zhongyu Wang, Xiaoxiao Zhu, Xuesong Jiang, Jifei Sun, Ling Wang, Boyuan Ban, Jian Chen

Chlorination roasting is widely recognized as one of the most effective methods for removing lattice impurities. However, there are few studies on HCl gas chlorination roasting. To study the effect of HCl gas chlorination on the migration and removal of lattice impurities in quartz, the gangue minerals in quartz were first removed by the pre-purification process. The pre-purified quartz is subjected to HCl chlorination roasting in a wide high-temperature range of 900–1250 °C. The crystal structure changes of quartz and the mechanism of lattice impurity migration and removal were systematically studied by XRD, SEM, FTIR, TGA, XPS, and ICP-OES. The results show that after pre-purified quartz sand is roasted in HCl at 1200 °C for 2 h, high-purity quartz sand with a purity of 99.996% can be obtained. Chlorination roasting has a significant removal effect on the quartz lattice impurities Na and K, and a certain removal effect on impurities Al, but it has no impact on impurities Li and Ti. Chlorination roasting above 900 °C can effectively remove H2O and -OH from quartz, causing lattice expansion, which is beneficial for the migration and removal of impurities. The changes in the chemical composition of the quartz surface provide evidence for the formation and volatilization of chlorides.

氯化焙烧是目前公认的去除晶格杂质最有效的方法之一。然而,关于HCl气体氯化焙烧的研究很少。为了研究HCl气氯化对石英中晶格杂质迁移和去除的影响,首先采用预净化工艺去除石英中的脉石矿物。将预纯化的石英在900-1250℃的高温范围内进行HCl氯化焙烧。采用XRD、SEM、FTIR、TGA、XPS、ICP-OES等方法系统研究了石英的晶体结构变化及晶格杂质迁移和去除机理。结果表明,经预纯化的石英砂在1200℃的HCl中焙烧2 h后,可得到纯度为99.996%的高纯石英砂。氯化焙烧对石英晶格杂质Na和K有明显的去除效果,对杂质Al有一定的去除效果,但对杂质Li和Ti没有影响。900℃以上的氯化焙烧能有效去除石英中的H2O和-OH,使其晶格膨胀,有利于杂质的迁移和去除。石英表面化学成分的变化为氯化物的形成和挥发提供了证据。
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引用次数: 0
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