Wenmin Tang , Siyu Li , Yongming Huang , Hua Ming , Xianhuan Wang , Likun Li , Xuanguo Wang , Zhiyuan Liu
{"title":"激光冲击强化增材制造 CuSn 合金的表面强化机制:实验和数值模拟研究","authors":"Wenmin Tang , Siyu Li , Yongming Huang , Hua Ming , Xianhuan Wang , Likun Li , Xuanguo Wang , Zhiyuan Liu","doi":"10.1016/j.surfcoat.2024.131567","DOIUrl":null,"url":null,"abstract":"<div><div>Laser shock peening (LSP) is a widely used in the post-additive manufacturing industry for inducing compressive residual stress (CRS) and healing defects. Compared to traditional surface strengthening techniques, LSP provides the advantages of high machining precision and flexibility, achieving surface strengthening with minimal surface damage. This study conducted a series of LSP experiments on the additively manufactured Cu<img>Sn alloy with varying single pulse energy, which achieving defects healing and introducing CRS into surface. The experimental results confirm that the surface microstructure forms a finely-distributed layer within a uniform distribution after LSP. The surface hardness increased from 134(± 2.5) HV to 222(± 3.3) HV at maximum, and the CRS of −316 (± 85) MPa was introduced into the surface of sample. Moreover, after LSP treatment, the porosity was reduced from 5.4(± 1.5) % to 1.3(± 0.4) %, the surface corrosion resistance improved approximately 6.6-fold. Importantly, we propose a more accurate finite element model (FEM) for the spatial-temporal distribution of shock pressure and analyze the residual stress distribution caused by different laser energies. The experimental and FEM results have better agreement, which confirms the reasonability of the method. The method provides a theoretical approach for the fields related to laser processing such as laser forming and laser-induced surface structure.</div></div>","PeriodicalId":22009,"journal":{"name":"Surface & Coatings Technology","volume":"495 ","pages":"Article 131567"},"PeriodicalIF":5.3000,"publicationDate":"2024-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Surface strengthening mechanisms of laser shock peening additive manufacturing CuSn alloys: Experimental and numerical simulation investigations\",\"authors\":\"Wenmin Tang , Siyu Li , Yongming Huang , Hua Ming , Xianhuan Wang , Likun Li , Xuanguo Wang , Zhiyuan Liu\",\"doi\":\"10.1016/j.surfcoat.2024.131567\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Laser shock peening (LSP) is a widely used in the post-additive manufacturing industry for inducing compressive residual stress (CRS) and healing defects. Compared to traditional surface strengthening techniques, LSP provides the advantages of high machining precision and flexibility, achieving surface strengthening with minimal surface damage. This study conducted a series of LSP experiments on the additively manufactured Cu<img>Sn alloy with varying single pulse energy, which achieving defects healing and introducing CRS into surface. The experimental results confirm that the surface microstructure forms a finely-distributed layer within a uniform distribution after LSP. The surface hardness increased from 134(± 2.5) HV to 222(± 3.3) HV at maximum, and the CRS of −316 (± 85) MPa was introduced into the surface of sample. Moreover, after LSP treatment, the porosity was reduced from 5.4(± 1.5) % to 1.3(± 0.4) %, the surface corrosion resistance improved approximately 6.6-fold. Importantly, we propose a more accurate finite element model (FEM) for the spatial-temporal distribution of shock pressure and analyze the residual stress distribution caused by different laser energies. The experimental and FEM results have better agreement, which confirms the reasonability of the method. The method provides a theoretical approach for the fields related to laser processing such as laser forming and laser-induced surface structure.</div></div>\",\"PeriodicalId\":22009,\"journal\":{\"name\":\"Surface & Coatings Technology\",\"volume\":\"495 \",\"pages\":\"Article 131567\"},\"PeriodicalIF\":5.3000,\"publicationDate\":\"2024-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Surface & Coatings Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0257897224011988\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, COATINGS & FILMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface & Coatings Technology","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0257897224011988","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
Surface strengthening mechanisms of laser shock peening additive manufacturing CuSn alloys: Experimental and numerical simulation investigations
Laser shock peening (LSP) is a widely used in the post-additive manufacturing industry for inducing compressive residual stress (CRS) and healing defects. Compared to traditional surface strengthening techniques, LSP provides the advantages of high machining precision and flexibility, achieving surface strengthening with minimal surface damage. This study conducted a series of LSP experiments on the additively manufactured CuSn alloy with varying single pulse energy, which achieving defects healing and introducing CRS into surface. The experimental results confirm that the surface microstructure forms a finely-distributed layer within a uniform distribution after LSP. The surface hardness increased from 134(± 2.5) HV to 222(± 3.3) HV at maximum, and the CRS of −316 (± 85) MPa was introduced into the surface of sample. Moreover, after LSP treatment, the porosity was reduced from 5.4(± 1.5) % to 1.3(± 0.4) %, the surface corrosion resistance improved approximately 6.6-fold. Importantly, we propose a more accurate finite element model (FEM) for the spatial-temporal distribution of shock pressure and analyze the residual stress distribution caused by different laser energies. The experimental and FEM results have better agreement, which confirms the reasonability of the method. The method provides a theoretical approach for the fields related to laser processing such as laser forming and laser-induced surface structure.
期刊介绍:
Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance:
A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting.
B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.