用于经颅磁刺激低频电场剂量测定的新型体积积分方程法

IF 2.1 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Magnetics Pub Date : 2024-10-24 DOI:10.1109/TMAG.2024.3486081
Seyed Sina Vaezi;Luis J. Gomez
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引用次数: 0

摘要

本文介绍了一种新的体积积分方程(VIE)方法,用于研究低频经颅磁刺激(TMS)和高对比度介质。这种新的积分方程为导电介质低频电场(E-field)剂量测定中观察到的高对比度崩溃提供了一个简单的解决方案。具体来说,我们采用了对低频有效的适当近似值,并通过引入基扩展集来稳定 VIE,从而消除方程中与高特征值相关的解。新方程没有高对比度击穿,不需要使用辅助表面变量或投影器,为 TMS 的 VIE 分析提供了直接实用的解决方案。我们的研究结果表明,新的 VIE 公式与边界元、有限元和分析解法相匹配。这种新的 VIE 代表了将各向异性纳入用于脑刺激的积分方程 E 场剂量测定的第一步。
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Novel Volume Integral Equation Approach for Low-Frequency E-Field Dosimetry of Transcranial Magnetic Stimulation
A new volume integral equation (VIE) approach is introduced to study transcranial magnetic stimulation (TMS) and high-contrast media at low frequencies. This new integral equation offers a simple solution to the high-contrast breakdown observed in low-frequency electric field (E-field) dosimetry of conductive media. Specifically, we employ appropriate approximations that are valid for low frequencies and stabilize the VIE by introducing a basis expansion set that removes solutions associated with high eigenvalues in the equation. The new equation is devoid of high-contrast breakdown and does not require the use of auxiliary surface variables or projectors, providing a straightforward practical solution for the VIE analysis of TMS. Our results indicate that the novel VIE formulation matches boundary elements, finite elements, and analytical solutions. This new VIE represents a first step toward including anisotropy in integral equation E-field dosimetry for brain stimulation.
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来源期刊
IEEE Transactions on Magnetics
IEEE Transactions on Magnetics 工程技术-工程:电子与电气
CiteScore
4.00
自引率
14.30%
发文量
565
审稿时长
4.1 months
期刊介绍: Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The IEEE Transactions on Magnetics publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.
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2024 Index IEEE Transactions on Magnetics Vol. 60 Introducing IEEE Collabratec Front Cover Table of Contents Member Get-A-Member (MGM) Program
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