120 dB CMOS-MEMS阵列加速度计测量千克冲击事件的研究

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2024-10-16 DOI:10.1109/JMEMS.2024.3463406
Vincent P. J. Chung;Xiaoliang Li;Metin G. Guney;Jeyanandh Paramesh;Tamal Mukherjee;Gary K. Fedder
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引用次数: 0

摘要

本文报道了一种单片电容式加速度计阵列系统的开发,该系统的设计满量程为$\pm 5~{\ mathm {\text {k}{g}}$,带宽大于$10~{\ mathm {\text {k}\text {Hz}}$,最小分辨率为$\ mathm {5~\text {m}{g}}$,最小偏置不稳定性为$\ mathm {700~\mu {g}}$。加速度计的分辨率和满量程对应于120 dB的动态范围,与最先进的low- $\ mathm {{g}}$加速度计相当。通过纳米克级质量和相对刚性的折叠弯曲传感器设计,实现了高带宽和可检测性。高动态范围与$\ mathm {\text {k}{g}}$输入范围是由沙漏梁,交错锥形梳指电极和阵列加速度计实现的。加速度计阵列的设计为通过高冲击应用实现新兴导航提供了一条潜在的途径。[2024-0091]
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Toward 120 dB CMOS-MEMS Arrayed Accelerometers Measuring Through kg Shock Events
This paper reports on the development of a monolithic capacitive accelerometer array system that has a designed full-scale range of $\pm 5~{\mathrm {\text {k}{g} }}$ , a bandwidth larger than $10~{\mathrm {\text {k}\text {Hz} }}$ , with a minimum resolution of $\mathrm {5~\text {m}{g} }$ and a minimum bias instability of $\mathrm {700~\mu {g} }$ . The resolution and full-scale range of the accelerometers correspond to a dynamic range of 120 dB that is on par with state-of-the-art low- $\mathrm {{g} }$ accelerometers. High bandwidth and $\mathrm {\text {k}{g} }$ detectability are achieved by the nano-gram proof mass and relatively stiff folded-flexure transducer design. High dynamic range with $\mathrm {\text {k}{g} }$ input range is enabled by the hourglass-beam, interdigitated tapered comb-finger electrodes, and arrayed accelerometers. The accelerometer array design provides a potential path towards an emerging navigation through high-shock application.[2024-0091]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
期刊最新文献
2024 Index Journal of Microelectromechanical Systems Vol. 33 Table of Contents Front Cover Journal of Microelectromechanical Systems Publication Information TechRxiv: Share Your Preprint Research With the World!
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