先进互联优势节点中节能最后一级缓存的动态分段总线

IF 1.7 4区 计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Embedded Systems Letters Pub Date : 2024-12-05 DOI:10.1109/LES.2024.3444711
Mahta Mayahinia;Tommaso Marinelli;Zhenlin Pei;Hsiao-Hsuan Liu;Chenyun Pan;Zsolt Tokei;Francky Catthoor;Mehdi B. Tahoori
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引用次数: 0

摘要

系统技术协同优化(system-technology co-optimization, STCO)是一种解决方案,它涉及到从高层应用一直到底层技术的重要系统参数的协同优化。本文将高级节点中的互连优势问题作为基于节能静态RAM (SRAM)的最后一级缓存(LLC)的瓶颈,并旨在通过STCO机制缓解这一问题。我们在这项工作中的主要方法是利用工作负载感知控制的动态分段总线(DSB)作为内部(银行间)互连。根据我们的研究结果,我们的方法可以将基于sram的LLC的能源效率平均提高35%。
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Dynamic Segmented Bus for Energy-Efficient Last-Level Cache in Advanced Interconnect-Dominant Nodes
To deal with stagnated performance and energy improved by successive technology scaling, system-technology co-optimization (STCO) comes as a rescue which involves the co-optimization of the important system parameters from the high-level application all the way down to the low-level technology. This article addresses the interconnect dominance issue in advanced nodes as a bottleneck in energy-efficient static RAM (SRAM)-based last-level cache (LLC) and aims to mitigate it through an STCO mechanism. Our main approach in this work is the utilization of a workload-aware controlled dynamic segmented bus (DSB) as the intramacro (interbanks) interconnect. Based on our results, our approach can improve the energy efficiency of the SRAM-based LLC by an average of 35%.
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来源期刊
IEEE Embedded Systems Letters
IEEE Embedded Systems Letters Engineering-Control and Systems Engineering
CiteScore
3.30
自引率
0.00%
发文量
65
期刊介绍: The IEEE Embedded Systems Letters (ESL), provides a forum for rapid dissemination of latest technical advances in embedded systems and related areas in embedded software. The emphasis is on models, methods, and tools that ensure secure, correct, efficient and robust design of embedded systems and their applications.
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