利用 "大孔 "钻探技术结合数字图像相关性探索非均质残余应力场

IF 0.4 Q4 ENGINEERING, MECHANICAL Journal of Machinery Manufacture and Reliability Pub Date : 2024-12-16 DOI:10.1134/S1052618824700808
S. M. Usov, I. A. Razumovskii
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引用次数: 0

摘要

本研究探讨了数字图像相关方法在使用 "大孔 "钻孔技术对明显不均匀的残余应力场进行实验研究中的实际应用。使用了特殊设计的聚合物材料样品,并根据作者提出的方法在其中创建了高梯度残余应力场。在对典型问题的数值建模结果进行分析的基础上,提出了残余应力孔直径指示器与样品几何参数之间的最佳关系建议。研究结果表明,使用数字图像相关方法和作者的切向位移场数学处理软件,可以有效确定基于 "大孔 "钻孔方法的显著不均匀残余应力场。孔周围特征点的残余应力与其初始值的相对最大偏差不超过 4%,总体均方根偏差小于 7%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Exploring Inhomogeneous Residual Stress Fields Using the “Large Hole” Drilling Technique Combined with Digital Image Correlation

This study addresses the practical application of the digital image correlation method for experimental investigation of significantly inhomogeneous residual stress fields using the “large hole” drilling technique. Specially designed polymer material samples were used, in which a high-gradient residual stress field was created based on the approach proposed by the authors. Recommendations for optimal relationships between the diameter of the hole-indicator of residual stresses and the geometric parameters of the sample were developed based on the analysis of numerical modeling results of typical problems. The research results demonstrate the effectiveness of using the digital image correlation method and the authors’ software for mathematical processing of tangential displacement fields to determine significantly inhomogeneous residual stress fields based on the “large hole” drilling method. The relative maximum deviation of residual stresses at characteristic points around the hole from their initial values does not exceed 4%, and the overall root-mean-square deviation is less than 7%.

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来源期刊
CiteScore
0.80
自引率
33.30%
发文量
61
期刊介绍: Journal of Machinery Manufacture and Reliability  is devoted to advances in machine design; CAD/CAM; experimental mechanics of machines, machine life expectancy, and reliability studies; machine dynamics and kinematics; vibration, acoustics, and stress/strain; wear resistance engineering; real-time machine operation diagnostics; robotic systems; new materials and manufacturing processes, and other topics.
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