利用晶体塑性模拟晶间和晶内位错输运

IF 12.8 1区 材料科学 Q1 ENGINEERING, MECHANICAL International Journal of Plasticity Pub Date : 2025-02-01 Epub Date: 2024-12-30 DOI:10.1016/j.ijplas.2024.104222
Subhendu Chakraborty , Abigail Hunter , D.J. Luscher
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引用次数: 0

摘要

这项工作提出了晶体塑性材料模型的发展,该模型结合了晶粒内的位错传递和跨晶界的位错传递。该模型已在开源有限元代码MOOSE中实现。此外,提出了一种新的基于几何的判据来确定位错跨晶界转移的方向。传递准则结合了晶界的几何特征,如晶界平面法向及其取向偏差,这是通过进出滑动系统的取向来解释的。该模型在几种情况下进行了测试,包括铜单晶,双晶和多晶。详细讨论了转移准则的开发、模型的实现及其在这些测试用例中的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Modeling inter- and intra-granular dislocation transport using crystal plasticity
This work presents the development of a crystal plasticity material model that incorporates both dislocation transport within grains and dislocation transfer across grain boundaries. This model has been implemented in the open-source finite element code MOOSE. In addition, a novel geometry-based criterion is developed to determine the direction of dislocation transfer across grain boundaries. The transfer criterion incorporates the geometric features of the grain boundary, such as the grain boundary plane normal, and its misorientation, which is accounted for through the orientation of the incoming and outgoing slip systems. The model is tested with several cases, including a copper single crystal, bi-crystal, and polycrystal. The development of the transfer criterion, implementation of the model, and its application to these test cases are discussed in detail.
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来源期刊
International Journal of Plasticity
International Journal of Plasticity 工程技术-材料科学:综合
CiteScore
15.30
自引率
26.50%
发文量
256
审稿时长
46 days
期刊介绍: International Journal of Plasticity aims to present original research encompassing all facets of plastic deformation, damage, and fracture behavior in both isotropic and anisotropic solids. This includes exploring the thermodynamics of plasticity and fracture, continuum theory, and macroscopic as well as microscopic phenomena. Topics of interest span the plastic behavior of single crystals and polycrystalline metals, ceramics, rocks, soils, composites, nanocrystalline and microelectronics materials, shape memory alloys, ferroelectric ceramics, thin films, and polymers. Additionally, the journal covers plasticity aspects of failure and fracture mechanics. Contributions involving significant experimental, numerical, or theoretical advancements that enhance the understanding of the plastic behavior of solids are particularly valued. Papers addressing the modeling of finite nonlinear elastic deformation, bearing similarities to the modeling of plastic deformation, are also welcomed.
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