采用准自对准着陆垫,具有100 Ω寄生电阻和965 μA/μm导通电流的高性能GAA fet

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-11-25 DOI:10.1109/LED.2024.3505926
R. J. Jiang;P. Wang;J. X. Yao;X. X. Zhang;L. Cao;J. J. Li;G. Q. Sang;X. B. He;N. Zhou;Y. D. Zhang;C. C. Zhang;Z. H. Zhang;G. B. Bai;Y. H. Lu;L. L. Li;Q. K. Li;J. F. Gao;J. F. Li;Qingzhu Zhang;Huaxiang Yin;J. Luo;B. W. Dai
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When compared with devices with widely spaced LPs, reductions of 98.8% and 96.3% in the parasitic SD resistance (\n<inline-formula> <tex-math>${R}_{\\textit {SD}}$ </tex-math></inline-formula>\n) are observed for N/PFETs when using the QSA LPs technique, respectively. Therefore, the corresponding on-state current (\n<inline-formula> <tex-math>${I}_{\\textit {on}}$ </tex-math></inline-formula>\n) values are raised to \n<inline-formula> <tex-math>$965~\\mu $ </tex-math></inline-formula>\nA/\n<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>\nm and \n<inline-formula> <tex-math>$669~\\mu $ </tex-math></inline-formula>\nA/\n<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>\nm for 180 nm gate length N/PFETs, respectively. In addition, no significant changes are observed in the device subthreshold characteristics, including both the subthreshold swing and the on/off current ratios. 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引用次数: 0

摘要

为了克服栅极场效应晶体管(GAA fet)中严重外延缺陷导致的高寄生电阻和低驱动性能的挑战,提出了一种准自对准着陆垫(QSA lp)技术,并在GAA fet中实现了多层堆叠通道与单晶SiGe/Si超晶格源漏(SD)结构之间的无缺陷连接。与使用宽间距lp的器件相比,使用QSA lp技术时,N/ pfet的寄生SD电阻(${R}_{\textit {SD}}$)分别降低了98.8%和96.3%。因此,对应的导通电流(${I}_{\textit {on}}}$)值分别提高到$965~\mu $ A/ $\mu $ m和$669~\mu $ A/ $\mu $ m。此外,器件的亚阈值特性没有明显变化,包括亚阈值摆幅和通/关电流比。该方案为降低${R}_{\textit {SD}}$值和提高这些先进GAA器件的性能提供了一种新的有前途的方法。
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High-Performance GAA FETs With 100 Ω Parasitic Resistance and 965 μA/μm On-State Current Using Quasi-Self-Aligned Landing Pads
To overcome the challenges posed by the high parasitic resistance and poor driving performance induced by serious epitaxy defects in gate-all-around field-effect transistors (GAA FETs), a quasi-self-aligned landing pads (QSA LPs) technique is proposed, and defect-free connections among the multilayer stacked channels and single-crystal SiGe/Si superlattice source/drain (SD) structures are demonstrated in GAA FETs. When compared with devices with widely spaced LPs, reductions of 98.8% and 96.3% in the parasitic SD resistance ( ${R}_{\textit {SD}}$ ) are observed for N/PFETs when using the QSA LPs technique, respectively. Therefore, the corresponding on-state current ( ${I}_{\textit {on}}$ ) values are raised to $965~\mu $ A/ $\mu $ m and $669~\mu $ A/ $\mu $ m for 180 nm gate length N/PFETs, respectively. In addition, no significant changes are observed in the device subthreshold characteristics, including both the subthreshold swing and the on/off current ratios. The proposed scheme offers a new and promising approach to reduce the ${R}_{\textit {SD}}$ values and enhance the performance of these advanced GAA devices.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
期刊最新文献
Front Cover Table of Contents IEEE Transactions on Electron Devices Table of Contents IEEE Electron Device Letters Information for Authors EDS Meetings Calendar
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