玻璃芯基板的噪声耦合与屏蔽结构

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-11-07 DOI:10.1109/LED.2024.3493599
Zhen Fang;Jihua Zhang;Jinxu Liu;Ding Wen;Libin Gao;Hongwei Chen;Xingzhou Cai;Zhihua Tao;Wanli Zhang
{"title":"玻璃芯基板的噪声耦合与屏蔽结构","authors":"Zhen Fang;Jihua Zhang;Jinxu Liu;Ding Wen;Libin Gao;Hongwei Chen;Xingzhou Cai;Zhihua Tao;Wanli Zhang","doi":"10.1109/LED.2024.3493599","DOIUrl":null,"url":null,"abstract":"Despite the low dielectric constant and minimal loss of glass substrates, noise coupling remains a challenge in high-frequency, high-density interconnects. In this letter, six noise shielding structures are proposed, and a simplified TGV noise coupling circuit model is developed to estimate their effectiveness. Seven test vehicles were fabricated for comparison, and good agreement was observed between the measured, simulated, and estimated results. This analysis effectively estimates noise coupling without the need for complex simulations. Noise suppression improvements of 20 dB at 40 GHz and 35 dB at 60 GHz were achieved with the guard rings, significantly outperforming traditional techniques. A 40 dB reduction in noise at 60 GHz was achieved with the guard trenches. Proposed shielding structures and evaluation methods can be applied to noise coupling in future millimeter-wave broadband glass core substrate integration.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 1","pages":"84-87"},"PeriodicalIF":4.1000,"publicationDate":"2024-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Noise Coupling and Shielding Structures for Glass Core Substrate\",\"authors\":\"Zhen Fang;Jihua Zhang;Jinxu Liu;Ding Wen;Libin Gao;Hongwei Chen;Xingzhou Cai;Zhihua Tao;Wanli Zhang\",\"doi\":\"10.1109/LED.2024.3493599\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Despite the low dielectric constant and minimal loss of glass substrates, noise coupling remains a challenge in high-frequency, high-density interconnects. In this letter, six noise shielding structures are proposed, and a simplified TGV noise coupling circuit model is developed to estimate their effectiveness. Seven test vehicles were fabricated for comparison, and good agreement was observed between the measured, simulated, and estimated results. This analysis effectively estimates noise coupling without the need for complex simulations. Noise suppression improvements of 20 dB at 40 GHz and 35 dB at 60 GHz were achieved with the guard rings, significantly outperforming traditional techniques. A 40 dB reduction in noise at 60 GHz was achieved with the guard trenches. Proposed shielding structures and evaluation methods can be applied to noise coupling in future millimeter-wave broadband glass core substrate integration.\",\"PeriodicalId\":13198,\"journal\":{\"name\":\"IEEE Electron Device Letters\",\"volume\":\"46 1\",\"pages\":\"84-87\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electron Device Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10746531/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10746531/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

尽管玻璃基板具有低介电常数和最小损耗,但在高频、高密度互连中噪声耦合仍然是一个挑战。在本文中,提出了六种噪声屏蔽结构,并建立了一个简化的TGV噪声耦合电路模型来评估它们的有效性。制作了7辆试验车进行比较,在测量、模拟和估计结果之间观察到良好的一致性。这种分析可以有效地估计噪声耦合,而不需要复杂的模拟。该保护环在40 GHz和60 GHz频段的噪声抑制分别提高了20 dB和35 dB,显著优于传统技术。在60千兆赫的情况下,防护壕的噪声降低了40分贝。所提出的屏蔽结构和评价方法可用于未来毫米波宽带玻璃芯基板集成中的噪声耦合。
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Noise Coupling and Shielding Structures for Glass Core Substrate
Despite the low dielectric constant and minimal loss of glass substrates, noise coupling remains a challenge in high-frequency, high-density interconnects. In this letter, six noise shielding structures are proposed, and a simplified TGV noise coupling circuit model is developed to estimate their effectiveness. Seven test vehicles were fabricated for comparison, and good agreement was observed between the measured, simulated, and estimated results. This analysis effectively estimates noise coupling without the need for complex simulations. Noise suppression improvements of 20 dB at 40 GHz and 35 dB at 60 GHz were achieved with the guard rings, significantly outperforming traditional techniques. A 40 dB reduction in noise at 60 GHz was achieved with the guard trenches. Proposed shielding structures and evaluation methods can be applied to noise coupling in future millimeter-wave broadband glass core substrate integration.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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