具有电容失配自校准功能的16位1 ms /s SAR ADC

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-11-14 DOI:10.1109/TVLSI.2024.3489231
Jie Ding;Fuming Liu;Kuan Deng;Zihan Zheng;Jingnan Zheng;Yongzhen Chen;Jiangfeng Wu
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引用次数: 0

摘要

本文介绍了一种利用前景电容失配自校准方法的逐次逼近寄存器(SAR)模数转换器(ADC)。所提出的浮动操作使未校准的高位电容进入浮动状态,防止在校准过程中由比较器静态偏移引起的子adc饱和。为了解决LSB电容器随机失配的问题,提高校准精度,本文采用了8组LSB电容器的轮询分组。此外,提出了一种预充电自举开关,以低功耗和面积开销实现高采样线性度。针对电容式DAC (CDAC)的二元加权电容失配问题,提出了一种定制的抗干扰0.5-fF电容结构。此外,还讨论了ADC所使用的比较器的电路实现。该原型机采用180nm CMOS工艺,采用1.8 v电源,在输入频率为1khz,采样率分别为100ks /s和1ms /s的情况下,实现了108.9和92.38 dB的无杂散动态范围。样机功耗为6.745 mW,占用0.91 $\text {mm}^{2}$。
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A 16-bit 1-MS/s SAR ADC With Capacitor Mismatch Self-Calibration
This article introduces a successive approximation register (SAR) analog-to-digital converter (ADC) that utilizes a foreground capacitor mismatch self-calibration method. The proposed floating operation puts the uncalibrated high-bit capacitor into the floating state, preventing the sub-ADC from saturating caused by comparator static offset during the calibration process. To address the random mismatch of the LSB capacitors and improve the calibration accuracy, this article employs round-robin grouping of eight sets of LSB capacitors. In addition, a precharged bootstrapped switch is proposed to achieve high sampling linearity with low power consumption and area overhead. An anti-interference custom-designed 0.5-fF capacitor structure is suggested for binary-weighted capacitor mismatch of capacitive DAC (CDAC). Furthermore, the circuit implementation of the comparator utilized by ADC is also discussed. The prototype was fabricated in a 180-nm CMOS process with a 1.8-V supply and achieved spurious-free dynamic ranges of 108.9 and 92.38 dB at an input frequency of 1 kHz while operating at sampling rates of 100 kS/s and 1 MS/s, respectively. The prototype consumes 6.745 mW and occupies 0.91 $\text {mm}^{2}$ .
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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