弯曲应力下的模式分裂MEMS陀螺仪:检测模式耦合及其与跨轴灵敏度的关系

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Sensors Letters Pub Date : 2024-11-27 DOI:10.1109/LSENS.2024.3507212
Wolfram Mayer;Burkhard Kuhlmann;Andrea Guerrieri;Tobias Hiller;Andre Zimmermann
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引用次数: 0

摘要

本文对多轴MEMS陀螺仪的检测模式耦合进行了理论和实验研究。首先,通过用测试信号驱动检测模态来评估弯曲应力对检测模态传递行为的影响。实验表明,施加弯曲应力后,模态耦合明显增强。除此之外,用相同的设置测量了交叉轴灵敏度(CAS)。在文章的第二部分,对检测模式耦合进行了理论描述。通过实验结果与理论分析结果的比较,证明了弹簧耦合是引起弯曲应力模态耦合的主要耦合机制。在这项工作中,对弯曲应力方面的CAS进行了研究,并提供了进一步了解CAS起源的方面。
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Mode-Split MEMS Gyroscopes Under Bending Stress: Detection Mode Coupling and the Relation to Cross-Axis Sensitivity
In this letter, the detection mode coupling of multiaxis MEMS gyroscopes is investigated in theory and experiment. First, the impact of bending stress on the transfer behavior of the detection modes is evaluated by actuating the modes with test signals. It is shown experimentally that by applying bending stress, the mode coupling is significantly increased. Additional to that, cross-axis sensitivity (CAS) is measured with the same setup. In the second part of the article, theoretical descriptions of the detection mode coupling are developed. By comparing the experimental results with the theory, it is demonstrated, that spring coupling is the dominant coupling mechanism that induces the mode coupling with bending stress. In this work, CAS is investigated with respect to bending stress and a further aspect toward understanding the origins of CAS is provided.
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
期刊最新文献
Table of Contents Front Cover IEEE Sensors Council Information IEEE Sensors Letters Subject Categories for Article Numbering Information IEEE Sensors Letters Publication Information
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