Yuxin Ji;Yuhang Zhang;Changyan Chen;Jian Zhao;Fakhrul Zaman Rokhani;Yehea Ismail;Yongfu Li
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A 0.4 V, 12.2 pW Leakage, 36.5 fJ/Step Switching Efficiency Data Retention Flip-Flop in 22 nm FDSOI
Data-retention flip-flops (DR-FFs) efficiently maintain data during sleep mode, and retain state during transitions between active and sleep mode. This brief proposes an ultralow power DR-FF design with an improved autonomous data-retention (ADR) latch operating with a supply voltage range down to near/subthreshold, achieving a sleep mode leakage power of 12.2 pW, $1.4\times $ –$3.8\times $ less than the prior CMOS DR-FFs. Our proposed DR-FFs consume the lowest active mode switching efficiency of 36.5 fJ/step, $1.2\times $ –$4\times $ less than the prior works, and a comparable transition efficiency of 1.9 fJ/step. Furthermore, our proposed DR-FFs require minimal control signals, logic gates, and switches, significantly reducing design complexity, and avoiding the drawbacks of nonvolatile data retention FFs (NV-FFs).
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.