聚丁二烯聚氨酯丙烯酸酯光敏树脂及其在3D打印中的应用

IF 6.8 3区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Science: Advanced Materials and Devices Pub Date : 2025-03-01 Epub Date: 2024-12-31 DOI:10.1016/j.jsamd.2024.100844
Hang Ning , Shaoyun Chen , Yan'e Liu , Bo Qu , Yanyu Zheng , Xiaoying Liu , Wenjie Li , Rui Wang , Nairong Chen , Dongxian Zhuo
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引用次数: 0

摘要

为了应对各个领域日益增长的需求,需要能够承受温度变化的高性能树脂来扩大增材制造(3D打印)的应用潜力。本研究以端羟基聚丁二烯(HTPB)为基料,与其他活性稀释剂单体及甲基丙烯酸羟丙酯(HPMA)等光引发剂混合,制备了新型3d打印聚丁二烯聚氨酯丙烯酸酯光敏树脂HTPBMA。根据稀释单体的种类和比例,所制得的树脂具有良好的流变性能和快速的光固化能力。其中,HTPBMA:HPMA比例为65:35的试样在- 25℃下的抗拉强度和断裂伸长率分别为32.9 MPa和246.1%,分别是常温下的2.13倍和1.58倍。结果表明,HTPBMA具有优异的低温性能和物理性能。增强机制可能归因于引入柔性碳链以及增加交联密度(e)。这些优点表明,本研究设计和制备的新型光敏树脂可以用于光固化3D打印,并在极端气候条件下保持优异的性能。因此,所提出的HTPBMA在航空航天和材料科学,特别是在鞋类材料和轮胎方面具有广阔的应用前景。
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Polybutadiene polyurethane acrylate photosensitive resin and its application in 3D printing
High-performance resins that can withstand temperature changes are required to expand the application potential of additive manufacturing (3D printing) in response to increasing demand from various fields. In this study, a novel 3D-printing polybutadiene polyurethane acrylate photosensitive resin named HTPBMA was prepared by mixing hydroxyl-terminated polybutadiene (HTPB) as the base material with other active diluent monomers and photoinitiators, including hydroxypropyl methacrylate (HPMA). The resulting resins exhibited good rheological properties and rapid photocuring ability, depending on the type and proportion of diluent monomer. In particular, the tensile strength and elongation at break of the sample with a 65:35 HTPBMA:HPMA ratio at −25 °C were 32.9 MPa and 246.1%, respectively, being 2.13 and 1.58 times the values at room temperature, respectively. These results indicate that HTPBMA exhibits excellent low-temperature performance and physical properties. The enhancement mechanism can likely be attributed to introducing of a flexible carbon chain as well as increased cross-linking density (υe). These advantages suggest that the novel photosensitive resin designed and prepared in this study can be used for photocuring 3D printing and maintain excellent performance under extreme climatic conditions. Thus, the proposed HTPBMA has broad application prospects in aerospace and materials science, especially in shoe materials and tires.
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来源期刊
Journal of Science: Advanced Materials and Devices
Journal of Science: Advanced Materials and Devices Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.90
自引率
2.50%
发文量
88
审稿时长
47 days
期刊介绍: In 1985, the Journal of Science was founded as a platform for publishing national and international research papers across various disciplines, including natural sciences, technology, social sciences, and humanities. Over the years, the journal has experienced remarkable growth in terms of quality, size, and scope. Today, it encompasses a diverse range of publications dedicated to academic research. Considering the rapid expansion of materials science, we are pleased to introduce the Journal of Science: Advanced Materials and Devices. This new addition to our journal series offers researchers an exciting opportunity to publish their work on all aspects of materials science and technology within the esteemed Journal of Science. With this development, we aim to revolutionize the way research in materials science is expressed and organized, further strengthening our commitment to promoting outstanding research across various scientific and technological fields.
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