Mimi Huang , Yong Xia , Xiangguang Han , Yi Gao , Shuai Chen , Zeyu Cui , Cheng Zhang , Yushan Gao , Zhixia Qiao , Yang Lv , Xiaowei Hou , Chenying Wang , Ping Yang , Libo Zhao
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High-strength Au–Au bonding for temperature and pressure integrated sensor
With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O2 plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors.
期刊介绍：
The Journal of Materials Research and Technology is a publication of ABM - Brazilian Metallurgical, Materials and Mining Association - and publishes four issues per year also with a free version online (www.jmrt.com.br). The journal provides an international medium for the publication of theoretical and experimental studies related to Metallurgy, Materials and Minerals research and technology. Appropriate submissions to the Journal of Materials Research and Technology should include scientific and/or engineering factors which affect processes and products in the Metallurgy, Materials and Mining areas.
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