摩擦搅拌制备条件对Al2O3和AlN基板上Cu膜形成的影响

IF 2 4区材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS Thin Solid Films Pub Date : 2025-01-15 Epub Date: 2024-12-31 DOI:10.1016/j.tsf.2024.140599

Hirosuke Sonomura , Ryota Nonami , Gentoku Yoshida , Keigo Nakano , Kazuaki Katagiri , Tomoatsu Ozaki

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引用次数: 0

摘要

研究了在Al2O3和AlN衬底上摩擦搅拌形成Cu薄膜的条件，开发了一种Cu电路图案形成技术。不同的刀具几何形状导致不同的加工界面温度，这对Cu膜的形成有显著的影响。在100℃下加热具有高导热性的AlN衬底，有效地在其表面形成Cu薄膜。有限元模拟结果表明，当基材在100℃下加热时，即使在0.3 kN的弱刀具推力下，加工界面温度也高出78℃。棒材工具比管材工具对基材表面的粗化程度更高，铜膜与基材的机械结合强度更高。结果表明，摩擦搅拌是铜电路模式形成的有效工具。

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Effect of fabrication conditions on Cu film formation on Al2O3 and AlN substrates by friction stirring

The conditions for Cu film formation by friction stirring on Al₂O₃ and AlN substrates were investigated to develop a Cu circuit pattern formation technology. Different consumable tool geometries resulted in different processing interface temperatures, which had a significant effect on Cu film formation. A Cu film was formed effectively on the AlN substrate, which had high thermal conductivity, by heating the substrate at 100 °C. Finite element simulation revealed that when the substrate was heated at 100 °C, the processing interface temperature was 78 °C higher, even with a weak tool pushing force of 0.3 kN. The rod tool roughened the substrate surface more than the pipe tool, and the Cu film was mechanically bonded to the substrate with higher adhesion strength. Friction stirring was confirmed to be an effective tool for Cu circuit pattern formation.

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来源期刊

Thin Solid Films 工程技术-材料科学：膜

CiteScore

4.00

自引率

4.80%

发文量

381

审稿时长

7.5 months

期刊介绍： Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.