循环热管汽液界面可视化及汽槽优化

IF 6.9 2区 工程技术 Q2 ENERGY & FUELS Applied Thermal Engineering Pub Date : 2025-05-15 Epub Date: 2025-01-24 DOI:10.1016/j.applthermaleng.2025.125724
Zhou Xue , Hua Lingji , Shao Bo , Li Nanxi , Jiang Zhenhua , Lu Yan
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引用次数: 0

摘要

循环热管(LHPs)是一种利用毛细管力使工作流体在内部循环的高效热管理装置,已广泛应用于航空航天工业和家庭技术中。以往的研究提出了各种lhp的优化方法,并成功地提高了器件效率,但仍存在一些有争议的难题。在最佳槽尺寸上存在分歧,这种不一致可能是由于通常忽略了气液界面变化所施加的影响。因此,本文采用三维数值模拟模型和可视化实验相结合的方法,研究了不同槽型尺寸下lhp的汽液分布和热效率。随着汽槽深度与宽度之比(β)的增大,汽槽内液膜逐渐衰减并缩回芯内。当液体界面与固体界面重合时,即既不在灯芯表面上方也不在其下方时,热性能达到最佳,这对应于最佳的β值。根据实验和数值研究,在更大的热负荷范围内,该最优值约为1。另一方面,槽与翅片宽度之比(η)越小,壁面到汽液界面的热阻越小,蒸发器的温度也就越低。η的适宜范围为0.7 ~ 0.9,与汽液分布无明显关系。
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Visualization of vapor–liquid interface and optimization in vapor grooves of loop heat pipe
Loop heat pipes (LHPs), utilizing the capillary force to circulate working fluid internally, have been widely employed as an efficient thermal management device in both aerospace industries and household technologies. Previous studies have proposed various optimization methods for LHPs and have succeeded in improving the device efficiency, while there still exist some difficult problems in dispute. A disagreement is on the optimal groove size and such inconsistency can be owing to the common neglect on the influence imposed by the changing vapor–liquid interface. In this work, therefore, a three-dimensional numerical simulation model and a visualization experiment were used to simultaneously investigate the vapor–liquid distribution and the thermal efficiency of the LHPs with different groove dimensions. The liquid film in the vapor groove gradually attenuates and retracts into the wick as the ratio of the depth and width of vapor groove (β) increases. The optimal thermal performance is achieved once the liquid interface coincides with the solid interface, namely, neither well above the wick surface nor beneath it, which corresponds to an optimal β value. Based on the experimental and numerical studies, such optimal value is around 1 over a wider range of heat loads. On the other hand, the lower the ratio of the width for grooves and fins (η), the less thermal resistance there is from the wall to the vapor–liquid interface, and thus the lower the temperature of the evaporator. The suitable range of η is within 0.7–0.9 exhibiting no clear dependency on the vapor–liquid distribution.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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