基于面内流动模型的三维保形冷却通道拓扑优化

IF 7.5 2区 工程技术 Q2 ENERGY & FUELS Applied Thermal Engineering Pub Date : 2025-05-15 Epub Date: 2025-01-28 DOI:10.1016/j.applthermaleng.2025.125765
Jiahao Ba, Baotong Li, Xianglei Zeng, Rui Lu, Hui Jing, Jinglu Chen, Xiaoqing Huang, Jun Hong
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引用次数: 0

摘要

本文研究了三维共形冷却通道的拓扑优化问题。设计直接在三维曲面上进行,没有平面到曲面的投影。提出了一种曲面内流动(WSF)模型来模拟曲面上的流动,特别是不可展开曲面上的流动。WSF模型通过将完整的三维设计问题简化为基于表面的设计问题,降低了计算成本和结构复杂性。它的工作原理是将流动限制在两个无摩擦的绝热壁之间足够薄的层内。在这项工作中,使用基于密度的拓扑优化方法对热流体问题进行建模,并选择三种不可展开的表面-包括翘曲,球面和样条表面-作为案例研究。优化后的冷却通道呈分支状布局,并研究了过滤半径、流体能量耗散阈值和产热系数等超参数对冷却通道构型的影响。基于拓扑优化结果构建了全三维仿真,并与参考冷却通道进行了性能比较。验证表明了拓扑优化通道的优越性,并强调了确保WSF模型和全3D模拟之间进口雷诺数一致性的重要性。对于拓扑优化的冷却通道,与参考通道相比,翘曲表面的温升降低了6.37%,球面表面的温升降低了12.89%,样条表面的温升降低了19.38%。相应的压降降幅分别为20.94%、11.58%和23.53%。这项工作为基于拓扑优化的三维共形冷却通道设计提供了一条有前途的途径。
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Topology optimization of 3D conformal cooling channels using within-surface flow model
This paper investigates the topology optimization of 3D conformal cooling channels. The design is performed directly on the 3D curved surface, without plane-to-surface projection. A within-surface flow (WSF) model is proposed to simulate flow on curved surfaces, especially non-developable surfaces. The WSF model reduces computational cost and structural complexity by simplifying the full 3D design problem into a surface-based one. It operates by confining the flow within a sufficiently thin layer between two frictionless, adiabatic walls. In this work, the thermofluid problems are modeled using a density-based topology optimization method, and three non-developable surfaces—including warped, spherical, and spline surfaces—are selected as case studies. The optimized cooling channel presents a branched layout, and the effects of hyperparameters—including filter radius, fluid energy dissipation threshold, and heat generation coefficient—on the configuration of cooling channels are investigated. The full 3D simulations are constructed based on the topology optimization results, and their performance is compared with reference cooling channels. The validations show the superiority of the topology-optimized channels and highlight the importance of ensuring consistency in inlet Reynolds numbers between the WSF model and full 3D simulations. For topology-optimized cooling channels, the temperature rise reductions compared to reference channels are 6.37% on warped surfaces, 12.89% on spherical surfaces, and 19.38% on spline surfaces. The corresponding pressure drop reductions are 20.94%, 11.58%, and 23.53%, respectively. This work suggests a promising pathway for the design of 3D conformal cooling channels based on topology optimization.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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