Ancang Yang , Jiale Wu , Bin Zhang , Yonghua Duan , Lishi Ma , Mingjun Peng , Shanju Zheng , Lin Su , Mengnie Li
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Screening corrosion-resistant genetic elements of Sn-0.7Cu solders by high-throughput calculations
The long-term challenge faced by Sn-0.7Cu eutectic solder is that the addition of alloying elements can lead to a decrease in corrosion performance. Herein, we report a new design scheme for screening Sn-0.7Cu type solders with corrosion resistant genetic elements from 30 alternative elements. The results indicate that economical Al, Zn and Ni are potential candidate genetic elements. After the adding genetic elements, the strain energy decreases. Corrosion cracks are difficult to open, extend, and propagate along the interface. The present findings may provide a feasible strategy for improving the corrosion resistance of multi-element Sn-based alloy solders.
期刊介绍:
Corrosion occurrence and its practical control encompass a vast array of scientific knowledge. Corrosion Science endeavors to serve as the conduit for the exchange of ideas, developments, and research across all facets of this field, encompassing both metallic and non-metallic corrosion. The scope of this international journal is broad and inclusive. Published papers span from highly theoretical inquiries to essentially practical applications, covering diverse areas such as high-temperature oxidation, passivity, anodic oxidation, biochemical corrosion, stress corrosion cracking, and corrosion control mechanisms and methodologies.
This journal publishes original papers and critical reviews across the spectrum of pure and applied corrosion, material degradation, and surface science and engineering. It serves as a crucial link connecting metallurgists, materials scientists, and researchers investigating corrosion and degradation phenomena. Join us in advancing knowledge and understanding in the vital field of corrosion science.