制备Mo-14Re/inconel 625坚固钎焊接头的两种途径：显微组织和力学性能

IF 3.9 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2025-04-01 Epub Date: 2025-01-19 DOI:10.1016/j.vacuum.2025.114051

Yanming He , Suqing Yao , Jialong Nie , Jiabing Liang , Huaxin Li , Lei Shi , Yuan Sun , Shengxuan Yang , Weijiang Guo , Chuanyang Lu , Jianguo Yang , Yafei Li

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引用次数: 0

摘要

采用传统的ni -2或Cu中间层钎焊Mo-14Re/Inconel 625合金接头时，由于基材之间的热膨胀系数（CTE）存在较大的不匹配，导致其结合强度不理想，出现裂纹。在本研究中，Mo-14Re与Inconel 625采用两种钎焊方式：1)由于钎焊接头中以高强、延展性强的Au（s,s）为主，采用Au- ni膏体一步钎焊，抗剪强度可达547.9 MPa；2)采用Ti-Zr-Cu-Ni填料和Nb中间层进行两步钎焊，可调节脆性金属间化合物的形成和残余应力，使钎焊接头无裂纹。

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Two routes to produce robust Mo-14Re/inconel 625 brazed joint: Microstructure and mechanical performance

The Mo-14Re/Inconel 625 alloy joint brazed using traditional BNi-2 or Cu interlayers generally exhibited unsatisfactory bonding strength and cracks due to a large mismatch of coefficient of thermal expansion (CTE) between the base materials. In this study, Mo-14Re and Inconel 625 were brazed using two routes: 1) One-step brazing with Au-Ni paste achieved a shear strength up to 547.9 MPa, due to the predominance of high-strength and ductile Au(s,s) in the brazed joint; 2) Two-step brazing with Ti-Zr-Cu-Ni filler and Nb interlayer, which regulated the formation of the brittle intermetallic compounds and residual stress, produced a crack-free brazed joint.

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.