{"title":"用裂隙扫描拉曼显微镜控制石墨烯场效应晶体管阵列的质量","authors":"Shota Ushiba*, Tomomi Nakano, Yuka Tokuda, Shinsuke Tani, Masahiko Kimura and Kazuhiko Matsumoto, ","doi":"10.1021/acsaelm.4c02119","DOIUrl":null,"url":null,"abstract":"<p >Large-scale graphene films enable the integration of graphene field-effect transistor (GFET) arrays onto chips. However, the transfer characteristics display variability across the array. This significant statistical variation in graphene quality combined with the lack of standardized protocols poses a major challenge to commercialization. In this study, we present a rapid, extensive, and high-resolution inspection technique using slit-scanning Raman microscopy. Raman imaging of all GFETs in the arrays was performed before conducting electrical measurements. The G-band and 2D-band peak positions were used to determine the hole carrier density (<i>n</i><sub>H</sub>) in the GFETs. Variations in <i>n</i><sub>H</sub> values across the arrays correlated with the <i>V</i><sub>DP</sub> values, which is a critical parameter of FET performance, validating this approach as an inspection method. Moreover, Raman peaks were tracked across 100 GFETs at different processing stages, revealing that spatial variations originated during the wet-transfer process. This method is vital for the scalable manufacturing of graphene devices.</p>","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"7 3","pages":"1209–1216 1209–1216"},"PeriodicalIF":4.7000,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Quality Control of Graphene Field-Effect Transistor Arrays Using Slit-Scanning Raman Microscopy\",\"authors\":\"Shota Ushiba*, Tomomi Nakano, Yuka Tokuda, Shinsuke Tani, Masahiko Kimura and Kazuhiko Matsumoto, \",\"doi\":\"10.1021/acsaelm.4c02119\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p >Large-scale graphene films enable the integration of graphene field-effect transistor (GFET) arrays onto chips. However, the transfer characteristics display variability across the array. This significant statistical variation in graphene quality combined with the lack of standardized protocols poses a major challenge to commercialization. In this study, we present a rapid, extensive, and high-resolution inspection technique using slit-scanning Raman microscopy. Raman imaging of all GFETs in the arrays was performed before conducting electrical measurements. The G-band and 2D-band peak positions were used to determine the hole carrier density (<i>n</i><sub>H</sub>) in the GFETs. Variations in <i>n</i><sub>H</sub> values across the arrays correlated with the <i>V</i><sub>DP</sub> values, which is a critical parameter of FET performance, validating this approach as an inspection method. Moreover, Raman peaks were tracked across 100 GFETs at different processing stages, revealing that spatial variations originated during the wet-transfer process. This method is vital for the scalable manufacturing of graphene devices.</p>\",\"PeriodicalId\":3,\"journal\":{\"name\":\"ACS Applied Electronic Materials\",\"volume\":\"7 3\",\"pages\":\"1209–1216 1209–1216\"},\"PeriodicalIF\":4.7000,\"publicationDate\":\"2025-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Electronic Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://pubs.acs.org/doi/10.1021/acsaelm.4c02119\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acsaelm.4c02119","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Quality Control of Graphene Field-Effect Transistor Arrays Using Slit-Scanning Raman Microscopy
Large-scale graphene films enable the integration of graphene field-effect transistor (GFET) arrays onto chips. However, the transfer characteristics display variability across the array. This significant statistical variation in graphene quality combined with the lack of standardized protocols poses a major challenge to commercialization. In this study, we present a rapid, extensive, and high-resolution inspection technique using slit-scanning Raman microscopy. Raman imaging of all GFETs in the arrays was performed before conducting electrical measurements. The G-band and 2D-band peak positions were used to determine the hole carrier density (nH) in the GFETs. Variations in nH values across the arrays correlated with the VDP values, which is a critical parameter of FET performance, validating this approach as an inspection method. Moreover, Raman peaks were tracked across 100 GFETs at different processing stages, revealing that spatial variations originated during the wet-transfer process. This method is vital for the scalable manufacturing of graphene devices.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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