Mohamad Al Trjman , Alexander H.J. Salten , Felix Beule , Dominik Teutenberg , Gerson Meschut , Julia Riese , Eugeny Y. Kenig
{"title":"粘接时指法粘稠","authors":"Mohamad Al Trjman , Alexander H.J. Salten , Felix Beule , Dominik Teutenberg , Gerson Meschut , Julia Riese , Eugeny Y. Kenig","doi":"10.1016/j.ijadhadh.2025.103960","DOIUrl":null,"url":null,"abstract":"<div><div>Due to the adoption of multi-material construction methods in modern lightweight design, along with the use of adhesive bonding technology, thermally induced relative displacements between the joining components arise during the curing process. As a result, the original bond area is significantly reduced and exhibits a meandering structure. This structure, once cured, can lead to increased stress buildup in the joint due to the reduced adhesive area and the notch effect.</div><div>This work focuses on the experimental characterization and numerical description of a problem known as “viscous fingering”. To investigate this, adhesive surface reduction is experimentally investigated using a butt-bonded joint specimen (BJS) and an LWF–KS2 specimen at various displacements. Additionally, two-phase fluid simulations are carried out using computational fluid dynamics (CFD) to predict the formation of the adhesive surface. The finite element (FE) method is also used to analyze the adhesive surface reduction and simulate the mechanical properties of the bonded joint.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103960"},"PeriodicalIF":3.5000,"publicationDate":"2025-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Viscous fingering in adhesive bonding\",\"authors\":\"Mohamad Al Trjman , Alexander H.J. Salten , Felix Beule , Dominik Teutenberg , Gerson Meschut , Julia Riese , Eugeny Y. Kenig\",\"doi\":\"10.1016/j.ijadhadh.2025.103960\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Due to the adoption of multi-material construction methods in modern lightweight design, along with the use of adhesive bonding technology, thermally induced relative displacements between the joining components arise during the curing process. As a result, the original bond area is significantly reduced and exhibits a meandering structure. This structure, once cured, can lead to increased stress buildup in the joint due to the reduced adhesive area and the notch effect.</div><div>This work focuses on the experimental characterization and numerical description of a problem known as “viscous fingering”. To investigate this, adhesive surface reduction is experimentally investigated using a butt-bonded joint specimen (BJS) and an LWF–KS2 specimen at various displacements. Additionally, two-phase fluid simulations are carried out using computational fluid dynamics (CFD) to predict the formation of the adhesive surface. The finite element (FE) method is also used to analyze the adhesive surface reduction and simulate the mechanical properties of the bonded joint.</div></div>\",\"PeriodicalId\":13732,\"journal\":{\"name\":\"International Journal of Adhesion and Adhesives\",\"volume\":\"139 \",\"pages\":\"Article 103960\"},\"PeriodicalIF\":3.5000,\"publicationDate\":\"2025-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Adhesion and Adhesives\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0143749625000272\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"2025/2/5 0:00:00\",\"PubModel\":\"Epub\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Adhesion and Adhesives","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0143749625000272","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/2/5 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
Due to the adoption of multi-material construction methods in modern lightweight design, along with the use of adhesive bonding technology, thermally induced relative displacements between the joining components arise during the curing process. As a result, the original bond area is significantly reduced and exhibits a meandering structure. This structure, once cured, can lead to increased stress buildup in the joint due to the reduced adhesive area and the notch effect.
This work focuses on the experimental characterization and numerical description of a problem known as “viscous fingering”. To investigate this, adhesive surface reduction is experimentally investigated using a butt-bonded joint specimen (BJS) and an LWF–KS2 specimen at various displacements. Additionally, two-phase fluid simulations are carried out using computational fluid dynamics (CFD) to predict the formation of the adhesive surface. The finite element (FE) method is also used to analyze the adhesive surface reduction and simulate the mechanical properties of the bonded joint.
期刊介绍：
The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.
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