{"title":"含缩醛结构的生物基聚苯并恶嗪：粘合、再粘合和降解性能","authors":"Renzhi Xu, Xin Lu, Zhong Xin","doi":"10.1016/j.polymer.2025.128180","DOIUrl":null,"url":null,"abstract":"<div><div>A degradable biobased polybenzoxazine with strong adhesion property was fabricated through incorporating of acetal structures. A main-chain type benzoxazine precursor (DVEA-dad) was prepared from a diacetal derived from vanillin and erythritol, 1,10-diaminodecane and paraformaldehyde. The structure and curing behavior of DVEA-dad were investigated in detail. The cured polybenzoxazine (PDVEA-dad) possessed a glass transition temperature (<em>T</em><sub>g</sub>) of 154 °C according to the result of dynamic mechanical analysis (DMA). When utilized as adhesives for metal sheets, PDVEA-dad exhibited high lap shear strength up to 9.4 ± 0.9 MPa for steel sheets. The dynamic exchange of acetal bonds enabled PDVEA-dad to have rebonding and reprocessing properties. Additionally, the results of chemical degradation experiments revealed that PDVEA-dad could be degraded completely under acidic conditions through the cleavage of acetal bonds. This work provided an effective solution to promote the development of biobased polybenzoxazine adhesives.</div></div>","PeriodicalId":405,"journal":{"name":"Polymer","volume":"323 ","pages":"Article 128180"},"PeriodicalIF":4.5000,"publicationDate":"2025-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Biobased polybenzoxazine containing acetal structures: Adhesion, rebonding, and degradation properties\",\"authors\":\"Renzhi Xu, Xin Lu, Zhong Xin\",\"doi\":\"10.1016/j.polymer.2025.128180\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>A degradable biobased polybenzoxazine with strong adhesion property was fabricated through incorporating of acetal structures. A main-chain type benzoxazine precursor (DVEA-dad) was prepared from a diacetal derived from vanillin and erythritol, 1,10-diaminodecane and paraformaldehyde. The structure and curing behavior of DVEA-dad were investigated in detail. The cured polybenzoxazine (PDVEA-dad) possessed a glass transition temperature (<em>T</em><sub>g</sub>) of 154 °C according to the result of dynamic mechanical analysis (DMA). When utilized as adhesives for metal sheets, PDVEA-dad exhibited high lap shear strength up to 9.4 ± 0.9 MPa for steel sheets. The dynamic exchange of acetal bonds enabled PDVEA-dad to have rebonding and reprocessing properties. Additionally, the results of chemical degradation experiments revealed that PDVEA-dad could be degraded completely under acidic conditions through the cleavage of acetal bonds. This work provided an effective solution to promote the development of biobased polybenzoxazine adhesives.</div></div>\",\"PeriodicalId\":405,\"journal\":{\"name\":\"Polymer\",\"volume\":\"323 \",\"pages\":\"Article 128180\"},\"PeriodicalIF\":4.5000,\"publicationDate\":\"2025-04-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0032386125001661\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"2025/2/19 0:00:00\",\"PubModel\":\"Epub\",\"JCR\":\"Q2\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032386125001661","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/2/19 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Biobased polybenzoxazine containing acetal structures: Adhesion, rebonding, and degradation properties
A degradable biobased polybenzoxazine with strong adhesion property was fabricated through incorporating of acetal structures. A main-chain type benzoxazine precursor (DVEA-dad) was prepared from a diacetal derived from vanillin and erythritol, 1,10-diaminodecane and paraformaldehyde. The structure and curing behavior of DVEA-dad were investigated in detail. The cured polybenzoxazine (PDVEA-dad) possessed a glass transition temperature (Tg) of 154 °C according to the result of dynamic mechanical analysis (DMA). When utilized as adhesives for metal sheets, PDVEA-dad exhibited high lap shear strength up to 9.4 ± 0.9 MPa for steel sheets. The dynamic exchange of acetal bonds enabled PDVEA-dad to have rebonding and reprocessing properties. Additionally, the results of chemical degradation experiments revealed that PDVEA-dad could be degraded completely under acidic conditions through the cleavage of acetal bonds. This work provided an effective solution to promote the development of biobased polybenzoxazine adhesives.
期刊介绍：
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
