纳米铜修饰三维钛酸钙制备可调高介电储能环氧复合材料

IF 5.6 2区 材料科学 Q1 MATERIALS SCIENCE, CERAMICS Ceramics International Pub Date : 2025-03-01 Epub Date: 2024-12-30 DOI:10.1016/j.ceramint.2024.12.489
Yongzhi Yang , Xiaoqian Liu , Yuchao Li , Minghui Lu , Ziyu Zhang , Yanhu Zhan , Yankai Li , Zhi-Min Dang , Shao-Long Zhong , Dongxin He , Zhicheng Shi
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引用次数: 0

摘要

随着半导体电力电子器件的不断发展和5G等系统工作频率的不断提高,迫切需要具有高介电常数和能量密度同时又能降低介电损耗的储能单元。实现这种优化对于减轻电子设备的热失效和提高其运行可靠性和使用寿命至关重要。通过将环氧树脂反渗透到预先构建的以纳米铜修饰的钛酸钙(CTO)三维网络中,成功制备了三维CTO- cu /环氧树脂(EP)介电复合材料。连续的3D CTO结构通过简单的溶胶-凝胶工艺创建,确保了铜(Cu)纳米颗粒在整个结构中的均匀分布,协同提高了3D CTO-Cu/EP复合材料的整体性能。此外,利用等效微电容器和Cu纳米颗粒产生的库仑封锁效应,3D CTO-Cu/EP复合材料的介电性能得到了显著增强,同时有效抑制了介电损耗,这是一项特别具有挑战性的成就。3D CTO-0.2 cu /EP体系的介电常数最高为28.0 (1 kHz),介电损耗最低为0.021,分别比3D CTO/EP复合材料提高了184%和70%,为调整聚合物基介电性能和储能性能提供了一种有效的方法。
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Facile construction of copper nanoparticles decorated 3D calcium titanate toward tunable high dielectric and energy storage epoxy composites
With the continuous development of semiconductor power electronic devices and the rising operating frequencies of systems such as 5G, there is an urgent need for energy storage units that exhibit high dielectric constants and energy densities while simultaneously reducing dielectric losses. Achieving this optimization is critical for mitigating thermal failure in electronic devices and enhancing their operational reliability and service life. A 3D CTO-Cu/epoxy (EP) dielectric composite has been successfully fabricated by reverse-infiltrating epoxy into a pre-constructed 3D network of calcium titanate (CTO) decorated with copper nanoparticles. The continuous 3D CTO architecture, created via a facile sol-gel process, ensures uniform distribution of copper (Cu) nanoparticles throughout the structure, synergistically enhancing the overall performance of 3D CTO-Cu/EP composite. Moreover, in virtue of the equivalent micro-capacitors and the Coulomb-blockade effect generated by the Cu nanoparticles, the dielectric properties of the 3D CTO-Cu/EP composites were significantly enhanced, while the dielectric loss was simultaneously and effectively suppressed—an achievement that is particularly challenging to realize. The 3D CTO-0.2Cu/EP system achieved the highest dielectric constant of 28.0 (at 1 kHz) and the lowest dielectric loss of 0.021, which are 184 % and 70 % improvements over the 3D CTO/EP composite, respectively, offering an effective method to adjust the dielectric and energy storage properties of polymer-based dielectrics.
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来源期刊
Ceramics International
Ceramics International 工程技术-材料科学:硅酸盐
CiteScore
9.40
自引率
15.40%
发文量
4558
审稿时长
25 days
期刊介绍: Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.
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