一类苯二呋喃酮基共轭共聚物在NDMBI-H序贯掺杂取向薄膜中的热电性能

IF 5.9 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Advanced Electronic Materials Pub Date : 2026-03-23 Epub Date: 2025-03-17 DOI:10.1002/aelm.202500047
Shubhradip Guchait, Diego R. Hinojosa, Nathan James Pataki, Said Oummouch, Laurent Herrmann, Mario Caironi, Michael Sommer, Martin Brinkmann
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摘要

本研究证明了采用聚合物取向(高温摩擦)和N-DMBI-H掺杂相结合的方法提高n型苯二呋喃酮基共聚物热电性能的可能性。它侧重于侧链长度和共聚单体(噻吩与呋喃)的化学性质对该方法有效性的影响,该方法保留了该聚合物家族的易溶液可加工性,并使有效的顺序掺杂无需热激活步骤。高温摩擦和热退火的结合有助于与噻吩共聚物获得高取向的共聚物,而不考虑侧链的长度,而呋喃基聚合物是边缘排列的。噻吩基共聚物的高取向性导致电导率和功率因数的显著提高,分别达到9.8±1.6 S cm−1和8±3µW m−1。分别K2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Thermoelectric Properties of a Family of Benzodifuranone-Based Conjugated Copolymers in Oriented Thin Films Doped Sequentially With NDMBI-H

This study demonstrates the possibility to enhance thermoelectric properties of n-type benzodifuranone-based copolymers using a combination of polymer orientation (using high temperature rubbing) and sequential doping with the dopant N-DMBI-H. It focuses on the impact of the side chain length and the chemical nature of the comonomer (thiophene vs furan) on the efficacy of this methodology that preserves the facile solution-processability of this polymer family and enables effective sequential doping without a thermal activation step. The combination of high temperature rubbing and thermal annealing helps reach a high orientation of the copolymers with the thiophene comonomer regardless of the length of the side chains whereas the furan-based polymer is marginally aligned. The high orientation of thiophene-based copolymers results in a strong improvement of electrical conductivity and power factors reaching up to 9.8 ± 1.6 S cm−1 and 8 ± 3 µW m−1.K2, respectively.

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来源期刊
Advanced Electronic Materials
Advanced Electronic Materials NANOSCIENCE & NANOTECHNOLOGYMATERIALS SCIE-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
11.00
自引率
3.20%
发文量
433
期刊介绍: Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.
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