IEEE电子器件学报特刊“用于射频和功率应用的宽带和超宽带隙半导体器件”征文

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Semiconductor Manufacturing Pub Date : 2023-08-04 DOI:10.1109/TSM.2023.3277155
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Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
期刊最新文献
Table of Contents Front Cover IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation Blank Page
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