Guest Editorial: Nanopackaging Part I

This is the first of two Special Sections on Nanopackaging. This first one has appeared in OJ-NANO Vol. 2, 2021 and the second will appear in Vol. 3, 2022. Electronics packaging is a very multidisciplinary activity requiring an understanding of Electrical, Mechanical, Materials, Thermal (and Thermomechanical) Engineering, and of the underlying Physics and Chemistry. The papers in these two Special sections will reflect this diversity, and the application of modern mathematical algorithms and computational techniques to advance the engineering design techniques. Nanopackaging could refer to the packaging of possibly disruptive nanoelectronics technologies, and this would undoubtedly be a challenging and useful field, but so far, the term has been applied more to the application of nanotechnologies to microelectronics packaging. Although this is the case with some of the papers in this collection, two are particularly driven by the packaging needs of the continuation of Moore’s Law into advanced nanoscales.