食品包装用铜颗粒功能化的柔性热塑性淀粉薄膜

Olivia V. López, María E. Villanueva, Guillermo J. Copello, Marcelo A. Villar
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引用次数: 6

摘要

以热塑性玉米淀粉(TPS)和铜颗粒为基材,研制了具有抗菌性能的生物可降解薄膜。采用了0.25 ~ 5%的铜纳米粒子(Cu)和硅包覆铜微粒(Si-Cu)。通过熔融混合和随后的热压得到复合膜。通过扫描电镜观察了硅铜颗粒在TPS基体中的分布,并观察了其孔隙和裂纹的存在。这两种填料的存在使复合膜呈棕色着色,并降低了其透明度;颗粒浓度越高,这些影响就越明显。力学性能方面,1%和5%的铜颗粒作为补强剂提高了薄膜的最大抗拉强度,但其存在导致断裂伸长率降低,影响薄膜的延展性。复合材料抑制了革兰氏+菌和革兰氏-菌的生长,显示了其抗菌能力。铜有效地迁移到含水食物的模拟介质中,模拟介质中的裸颗粒浓度高于细菌的最低抑制浓度。所研制的复合薄膜的特点和性能使其成为食品初级包装材料,主要用于肉类生鲜产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Flexible thermoplastic starch films functionalized with copper particles for packaging of food products

Biodegradable films based on thermoplastic corn starch (TPS) and copper particles with antimicrobial capacity were developed. Copper nanoparticles (Cu) and silica coated copper microparticles (Si-Cu) in the range of 0.25 to 5% were used. Composite films were obtained by melt-mixing and subsequent thermo-compression. Particles distribution within TPS matrix and the presence of some pores and cracks, induced by Si-Cu particles, was evaluated by SEM. The presence of both fillers gave composite films a brown pigmentation and decreased their transparency; these effects were more pronounced at higher particles concentrations. Regarding mechanical properties, copper particles at 1 and 5% acted as reinforcing agents increasing the maximum tensile strength but their presence lead to a decrease in elongation at break, affecting films ductility. Composites inhibited the growth of Gram+ and Gram- bacteria, demonstrating their antimicrobial capacity. Copper effectively migrated to a simulant of aqueous foods and naked particles concentration in the simulant medium resulted higher than the minimum inhibitory concentration for bacteria. The characteristics and properties of developed composite films make them an interesting material for food primary packaging, mainly for meat fresh products.

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