基于异质集成的多芯片通信聚合物波导光子互连

IF 1.1 4区 物理与天体物理 Q4 NANOSCIENCE & NANOTECHNOLOGY Journal of Nanophotonics Pub Date : 2022-07-01 DOI:10.1117/1.JNP.16.036002
R. Krishna, Rui Zhang, Siddharth Ravichandran, T. Fan, A. Hosseinnia, Jose Lopez-Ninantay, Fuhan Liu, M. Kathaperumal, Madhavan Swaminathan, A. Adibi
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引用次数: 0

摘要

摘要首次提出了一种封装内光学互连设计,将硅光子学与玻璃上聚合物中介层技术相结合,实现异质集成。玻璃基板用于低成本、高可靠性的封装,而硅光子学允许在较小的占地面积内进行高速调制和波分复用。通过将硅光子和苯并环丁烯玻璃内插器技术相结合,我们提出了一种可扩展的封装内光子互连,该互连可以提供>224的数据速率  Gb  /  s用于中等范围的链接。我们提出的互连考虑了光子铸造工艺中可用的微环调制器和高速检测器。我们提出了电力预算分析,以确定实现  <  1.  pJ  /  一点
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Polymer waveguide photonic interconnect for multichip communications-based heterogeneous integration
Abstract. An on-package optical interconnect design is proposed for the first time, with silicon photonics in conjunction with the polymer-on-glass interposer technology to enable heterogeneous integration. Glass substrates are used for low-cost, high reliability packaging while silicon photonics allows for high-speed modulation and wavelength division multiplexing within a small footprint. By combining silicon-photonic and benzo-cyclobutene-on-glass interposer technologies, we propose a scalable on-package photonic interconnect that can provide data rates >224  Gb  /  s for medium-reach links. Our proposed interconnect considers microring modulators and high-speed detectors available in photonic-foundry processes. We present the power-budget analysis to identify the key limiting parameters toward achieving an energy consumption of   <  1  pJ  /  bit.
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来源期刊
Journal of Nanophotonics
Journal of Nanophotonics 工程技术-光学
CiteScore
2.60
自引率
6.70%
发文量
42
审稿时长
3 months
期刊介绍: The Journal of Nanophotonics publishes peer-reviewed papers focusing on the fabrication and application of nanostructures that facilitate the generation, propagation, manipulation, and detection of light from the infrared to the ultraviolet regimes.
期刊最新文献
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