集成电路互连可靠性全球发展趋势综述

电路与系统(英文) Pub Date : 2018-02-08 DOI:10.4236/CS.2018.92002

Q. Lin, Haifeng Wu, Guoqing Jia

{"title":"集成电路互连可靠性全球发展趋势综述","authors":"Q. Lin, Haifeng Wu, Guoqing Jia","doi":"10.4236/CS.2018.92002","DOIUrl":null,"url":null,"abstract":"Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.","PeriodicalId":63422,"journal":{"name":"电路与系统(英文)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Review of the Global Trend of Interconnect Reliability for Integrated Circuit\",\"authors\":\"Q. Lin, Haifeng Wu, Guoqing Jia\",\"doi\":\"10.4236/CS.2018.92002\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.\",\"PeriodicalId\":63422,\"journal\":{\"name\":\"电路与系统(英文)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-02-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"电路与系统(英文)\",\"FirstCategoryId\":\"1093\",\"ListUrlMain\":\"https://doi.org/10.4236/CS.2018.92002\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"电路与系统(英文)","FirstCategoryId":"1093","ListUrlMain":"https://doi.org/10.4236/CS.2018.92002","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

摘要

互连可靠性从集成电路设计初期就被认为是一个必须认真考虑的问题。为了研究互连可靠性的现状和发展趋势，对已发表的文献进行了全面的综述。这可以描绘ic互连可靠性的全球趋势，并帮助新进入者了解这一领域的现状。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Review of the Global Trend of Interconnect Reliability for Integrated Circuit

Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.

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来源期刊

电路与系统(英文)

自引率

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发文量

273