A. Zare, M. Tunesi, T. Harriman, John R. Troutman, M. Davies, D. Lucca
{"title":"单晶表面车削(111):切削力学和表面/次表面特性","authors":"A. Zare, M. Tunesi, T. Harriman, John R. Troutman, M. Davies, D. Lucca","doi":"10.1115/1.4057054","DOIUrl":null,"url":null,"abstract":"\n Single crystal Ge is a semiconductor that has broad applications, especially in manipulation of infra-red (IR) light. Diamond machining enables the efficient production of surfaces with tolerances required by the optical industry. During machining of anisotropic single crystals, the cutting direction with respect to the in-plane lattice orientation plays a fundamental role in the final quality of the surface and subsurface. In this study, on-axis face turning experiments were performed on an undoped (111)Ge wafer to investigate the effects of crystal anisotropy and feedrate on the surface and subsurface condition. Atomic force microscopy and scanning white light interferometry were used to characterize the presence of brittle fracture on the machined surfaces and to evaluate the resultant surface roughness. Raman spectroscopy was performed to evaluate the residual stresses and lattice disorder induced by the tool during machining. Nanoindentation with Berkovich and cube corner indenter tips was performed to evaluate elastic modulus, hardness, and fracture toughness of the machined surfaces and to study their variations with feedrate and cutting direction. Post-indentation studies of selected indentations were also performed to characterize the corresponding quasi-plasticity mechanisms. It was found that an increase of feedrate produced a rotation of the resultant force imparted by the tool indication a shift from indentation-dominant to cutting-dominant behavior. Fracture increased with the feedrate and showed a higher propensity when the cutting direction belonged to the <112¯> family.","PeriodicalId":16299,"journal":{"name":"Journal of Manufacturing Science and Engineering-transactions of The Asme","volume":" ","pages":""},"PeriodicalIF":2.4000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Face Turning of Single Crystal (111)Ge: Cutting Mechanics and Surface/Subsurface Characteristics\",\"authors\":\"A. Zare, M. Tunesi, T. Harriman, John R. Troutman, M. Davies, D. Lucca\",\"doi\":\"10.1115/1.4057054\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Single crystal Ge is a semiconductor that has broad applications, especially in manipulation of infra-red (IR) light. Diamond machining enables the efficient production of surfaces with tolerances required by the optical industry. During machining of anisotropic single crystals, the cutting direction with respect to the in-plane lattice orientation plays a fundamental role in the final quality of the surface and subsurface. In this study, on-axis face turning experiments were performed on an undoped (111)Ge wafer to investigate the effects of crystal anisotropy and feedrate on the surface and subsurface condition. Atomic force microscopy and scanning white light interferometry were used to characterize the presence of brittle fracture on the machined surfaces and to evaluate the resultant surface roughness. Raman spectroscopy was performed to evaluate the residual stresses and lattice disorder induced by the tool during machining. Nanoindentation with Berkovich and cube corner indenter tips was performed to evaluate elastic modulus, hardness, and fracture toughness of the machined surfaces and to study their variations with feedrate and cutting direction. Post-indentation studies of selected indentations were also performed to characterize the corresponding quasi-plasticity mechanisms. It was found that an increase of feedrate produced a rotation of the resultant force imparted by the tool indication a shift from indentation-dominant to cutting-dominant behavior. Fracture increased with the feedrate and showed a higher propensity when the cutting direction belonged to the <112¯> family.\",\"PeriodicalId\":16299,\"journal\":{\"name\":\"Journal of Manufacturing Science and Engineering-transactions of The Asme\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2023-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Manufacturing Science and Engineering-transactions of The Asme\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4057054\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Science and Engineering-transactions of The Asme","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4057054","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Face Turning of Single Crystal (111)Ge: Cutting Mechanics and Surface/Subsurface Characteristics
Single crystal Ge is a semiconductor that has broad applications, especially in manipulation of infra-red (IR) light. Diamond machining enables the efficient production of surfaces with tolerances required by the optical industry. During machining of anisotropic single crystals, the cutting direction with respect to the in-plane lattice orientation plays a fundamental role in the final quality of the surface and subsurface. In this study, on-axis face turning experiments were performed on an undoped (111)Ge wafer to investigate the effects of crystal anisotropy and feedrate on the surface and subsurface condition. Atomic force microscopy and scanning white light interferometry were used to characterize the presence of brittle fracture on the machined surfaces and to evaluate the resultant surface roughness. Raman spectroscopy was performed to evaluate the residual stresses and lattice disorder induced by the tool during machining. Nanoindentation with Berkovich and cube corner indenter tips was performed to evaluate elastic modulus, hardness, and fracture toughness of the machined surfaces and to study their variations with feedrate and cutting direction. Post-indentation studies of selected indentations were also performed to characterize the corresponding quasi-plasticity mechanisms. It was found that an increase of feedrate produced a rotation of the resultant force imparted by the tool indication a shift from indentation-dominant to cutting-dominant behavior. Fracture increased with the feedrate and showed a higher propensity when the cutting direction belonged to the <112¯> family.
期刊介绍:
Areas of interest including, but not limited to: Additive manufacturing; Advanced materials and processing; Assembly; Biomedical manufacturing; Bulk deformation processes (e.g., extrusion, forging, wire drawing, etc.); CAD/CAM/CAE; Computer-integrated manufacturing; Control and automation; Cyber-physical systems in manufacturing; Data science-enhanced manufacturing; Design for manufacturing; Electrical and electrochemical machining; Grinding and abrasive processes; Injection molding and other polymer fabrication processes; Inspection and quality control; Laser processes; Machine tool dynamics; Machining processes; Materials handling; Metrology; Micro- and nano-machining and processing; Modeling and simulation; Nontraditional manufacturing processes; Plant engineering and maintenance; Powder processing; Precision and ultra-precision machining; Process engineering; Process planning; Production systems optimization; Rapid prototyping and solid freeform fabrication; Robotics and flexible tooling; Sensing, monitoring, and diagnostics; Sheet and tube metal forming; Sustainable manufacturing; Tribology in manufacturing; Welding and joining