Cracking mechanism analysis and experimental verification of encapsulated module under high low temperature cycle considering residual stress

Aiming at the cracking failure of the modified epoxy resin encapsulated module as a result of interface failure under high low temperature cycles, numerical simulation and experimental studies were carried out. Firstly, the residual stress field in the encapsulated module was reconstructed after measuring the curing residual stresses in epoxy resin using the hole-drilling method. Temperature-dependent material models were developed after testing the mechanical and thermal characteristic parameters of encapsulated module components, such as modified epoxy resin, in high and low temperature conditions. Then, a finite element model of a high-reduction encapsulated module with multiple components, multiple interfaces, and complicated contacts was established considering residual stress and temperature effects. To simulate the failure behaviour of the resin-embedded part interfaces, the cohesive zone model was utilized. Finally, the stress and strain of the encapsulated module under high and low temperature cycles were simulated, and their distribution features and cracking failure mechanism were analyzed. The results indicate that regardless of the heating/cooling process, significant due to a mismatch in thermal expansion coefficients between the resin and the embedded parts. As the temperature approaches the glass transition temperature Tg, the difference grows dramatically. The resulting thermal stress, together with the residual stress, led to the interface failure in encapsulated module. The numerical results were in good agreement with the high and low temperature cycle test results of the encapsulated module, which verified the effectiveness of the analysis method and the established finite element model. The investigation provides an important reference for the high-reliability design of the encapsulation module.