基于像素强度分布(PID)的颗粒材料形态识别

IF 1 4区 工程技术 Q4 INSTRUMENTS & INSTRUMENTATION Metrology and Measurement Systems Pub Date : 2023-07-20 DOI:10.24425/mms.2019.128357
A. Wójcik, Piotr Kościelniak, M. Mazur, T. Mathia
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引用次数: 3

摘要

本文对四种不同颗粒材料(豌豆、颗粒、小黑麦、木屑)的照片进行了统计分析。分析采用(参数)方差分析和(非参数)Kruskal-Wallis检验。此外,对两两比较进行(参数)双样本t检验和(非参数)Wilcoxon秩和检验。在每种情况下,都使用了Bonferroni校正。分析显示,统计证据表明,每组照片的直方图引起的各自的平均离散像素强度分布(PID)之间存在差异,这不能仅仅用不同材料的单个颗粒之间存在的差异来解释。提出的方法可能有助于开发一种快速检测方法,用于在生产过程中比较和区分与标准物质不同的颗粒材料。
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Morphological discrimination of granular materials by measurement of pixel intensity distribution (PID)
The paper provides statistical analysis of the photographs of four various granular materials (peas, pellets, triticale, wood chips). For analysis, the (parametric) ANOVA and the (nonparametric) Kruskal-Wallis tests were applied. Additionally, the (parametric) two-sample t-test and (non-parametric) Wilcoxon Rank-Sum Test for pairwise comparisons were performed. In each case, the Bonferroni correction was used. The analysis shows a statistical evidence of the presence of differences between the respective average discrete pixel intensity distributions (PID), induced by the histograms in each group of photos, which cannot be explained only by the existing differences among single granules of different materials. The proposed approach may contribute to the development of a fast inspection method for comparison and discrimination of granular materials differing from the reference material, in the production process.
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来源期刊
Metrology and Measurement Systems
Metrology and Measurement Systems INSTRUMENTS & INSTRUMENTATION-
CiteScore
2.00
自引率
10.00%
发文量
0
审稿时长
6 months
期刊介绍: Contributions are invited on all aspects of the research, development and applications of the measurement science and technology. The list of topics covered includes: theory and general principles of measurement; measurement of physical, chemical and biological quantities; medical measurements; sensors and transducers; measurement data acquisition; measurement signal transmission; processing and data analysis; measurement systems and embedded systems; design, manufacture and evaluation of instruments. The average publication cycle is 6 months.
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