基于模态分析的印刷电路板最佳安装支撑位置

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2023-03-07 DOI:10.1108/mi-07-2022-0126
Muthuram N., S. S.
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引用次数: 0

摘要

目的在模态分析的基础上,通过提高印刷电路板组件的固有频率,提高其使用寿命。设计/方法/方法在这项工作中,通过实验和数值模拟,试图将PCB组件的基本固有频率提高到实际可达到的水平,以最大限度地减少作用在其上的动态负载的影响。使用有限元软件(ANSYS)中的优化工具,在指定的设计空间中搜索六个紧固螺钉的最佳支撑位置。结果观察到,通过根据优化结果改变支撑位置,基本固有频率可以提高到51.1%,并通过实验验证了这一点。研究限制/含义计算机中使用的PCB制造商根据板的对称特性而不是组件的动态行为来固定支撑位置。这项工作可能会导致制造商重新设计其他表面安装组件的位置。实际意义这项工作为PCB制造商最终确定其支撑定位点提供了指导,这将改善PCB组件在运行过程中的动态特性。独创性/价值本研究提供了一种基于支撑位置优化的提高PCB寿命的新方法,该方法包括大多数表面安装组件,这些组件有助于PCB组件的总质量。
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A modal analysis based optimal mounting support locations of a printed circuit board
Purpose This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly. Design/methodology/approach In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws. Findings It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally. Research limitations/implications Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components. Practical implications This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning. Originality/value This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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