Reliability challenges in CMOS technology: A manufacturing process perspective

With the development of automotive electronics, the characteristics of device reliability have received widespread attention. The improvement of device reliability primarily depends on the manufacturing process's quality. This work reviews the inherent relationship between manufacturing processes and reliability with a detailed introduction to the components and failure indices of wafer-level reliability testing. Furthermore, it focuses on the complementary metal-oxide-semiconductor (CMOS) manufacturing process and how device reliability can be enhanced through optimization in front-end-of-line and back-end-of-line processes. Reliability serves as a crucial indicator of device quality, and further efforts are required to achieve higher reliability through process optimization.