嘉宾评论:小型化电子设备中高可靠性电力电子系统的新兴技术

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2023-06-06 DOI:10.1108/mi-07-2023-204
Zhaoyang Zhao, Chen Liu, Shuai Xu, Hongbo Zhao
{"title":"嘉宾评论:小型化电子设备中高可靠性电力电子系统的新兴技术","authors":"Zhaoyang Zhao, Chen Liu, Shuai Xu, Hongbo Zhao","doi":"10.1108/mi-07-2023-204","DOIUrl":null,"url":null,"abstract":"Power electronic converters are widely used to power miniaturized electronic devices in many important applications, such as communication base stations, data centers, wearable devices, smart homes and energy harvesting. However, power electronic converters are often affected by mechanical, electrical and thermal stresses, which contributes to increased equipment failures. Considering failed components may cause unexpected interruptions and serious safety issues, it is becoming even more important to improve the reliability of power electronic components and circuits. The call for paper of the Special Issue on Emerging Technologies for Highly-Reliable Power Electronic Systems in Miniaturized Electronic Devices was published in May 2022. We received eight submissions in total. Reviews were promptly organized by Guest Editors fromChina and Europe. Reviewers are invited from all over the globe. After rigorous reviews, five papers were accepted. Each of these accepted papers addresses one particular challenge with innovative solutions. The paper by Y. Song and her coauthors from Shandong University (Weinhai) and Beijing Jiaotong University presents an improved parallel five-level reinjection current source converter for self-commutation of thyristor converter. The simulation and experimental results verify the effectiveness of the proposed reinjection circuit driving method. The paper by F. Yang and his coauthors from China University of Mining and Technology and Zhengzhou University proposes a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of switched reluctance generators. The results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model. The paper by A. Sajja and his coauthors from Anurag University and K L University presents a chopper-stabilized amplifier with a cascoded operational transconductance amplifier. The total power consumption is 451 nW with a supplied voltage of 800mV. The Gain and common mode rejection ratio are 48 dB and 78 dB, respectively. The paper by M. Dai and his coauthors from Civil Aviation Flight University of China presents a dc-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation, which can work reliably and quickly no matter facing the problem as load-removed change or the ordinary operating conditions. The paper by H. Chen and his coauthors from China University of Mining and Technology, University of Engineering and Technology, Saint Petersburg National Research University of Information Technologies Mechanics and Optics, National Research University Moscow Power Engineering Institute, Asian University, West Pomeranian University of Technology and Peter the Great St Petersburg Polytechnic University presents a power converter and its control strategy to improve the efficiency of switched reluctance generators (SRGs). The results show that the SRG system can keep smooth operation by the full-bridge power converter with relatively high efficiency. We appreciate the efforts from all authors who had submitted papers and we appreciate timely reviews from reviewers, especially at this time of difficulty. We would like to express our deep gratefulness to Prof John Karl Atkinson, Editor-in-Chief, for his tremendous support from the initiative throughout the final stages of this Special Issue. Finally, we would like to thank the Microelectronics International staff involved with the production and technical support of this Special Issue. We look forward to seeing more great papers on Emerging Technologies for Highly-Reliable Power Electronic Systems in Microelectronics International in the time yet to come and your continuous support of the journal.","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":null,"pages":null},"PeriodicalIF":0.7000,"publicationDate":"2023-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Guest editorial: emerging technologies for highly-reliable power electronic systems in miniaturized electronic devices\",\"authors\":\"Zhaoyang Zhao, Chen Liu, Shuai Xu, Hongbo Zhao\",\"doi\":\"10.1108/mi-07-2023-204\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power electronic converters are widely used to power miniaturized electronic devices in many important applications, such as communication base stations, data centers, wearable devices, smart homes and energy harvesting. However, power electronic converters are often affected by mechanical, electrical and thermal stresses, which contributes to increased equipment failures. Considering failed components may cause unexpected interruptions and serious safety issues, it is becoming even more important to improve the reliability of power electronic components and circuits. The call for paper of the Special Issue on Emerging Technologies for Highly-Reliable Power Electronic Systems in Miniaturized Electronic Devices was published in May 2022. We received eight submissions in total. Reviews were promptly organized by Guest Editors fromChina and Europe. Reviewers are invited from all over the globe. After rigorous reviews, five papers were accepted. Each of these accepted papers addresses one particular challenge with innovative solutions. The paper by Y. Song and her coauthors from Shandong University (Weinhai) and Beijing Jiaotong University presents an improved parallel five-level reinjection current source converter for self-commutation of thyristor converter. The simulation and experimental results verify the effectiveness of the proposed reinjection circuit driving method. The paper by F. Yang and his coauthors from China University of Mining and Technology and Zhengzhou University proposes a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of switched reluctance generators. The results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model. The paper by A. Sajja and his coauthors from Anurag University and K L University presents a chopper-stabilized amplifier with a cascoded operational transconductance amplifier. The total power consumption is 451 nW with a supplied voltage of 800mV. The Gain and common mode rejection ratio are 48 dB and 78 dB, respectively. The paper by M. Dai and his coauthors from Civil Aviation Flight University of China presents a dc-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation, which can work reliably and quickly no matter facing the problem as load-removed change or the ordinary operating conditions. The paper by H. Chen and his coauthors from China University of Mining and Technology, University of Engineering and Technology, Saint Petersburg National Research University of Information Technologies Mechanics and Optics, National Research University Moscow Power Engineering Institute, Asian University, West Pomeranian University of Technology and Peter the Great St Petersburg Polytechnic University presents a power converter and its control strategy to improve the efficiency of switched reluctance generators (SRGs). The results show that the SRG system can keep smooth operation by the full-bridge power converter with relatively high efficiency. We appreciate the efforts from all authors who had submitted papers and we appreciate timely reviews from reviewers, especially at this time of difficulty. We would like to express our deep gratefulness to Prof John Karl Atkinson, Editor-in-Chief, for his tremendous support from the initiative throughout the final stages of this Special Issue. Finally, we would like to thank the Microelectronics International staff involved with the production and technical support of this Special Issue. We look forward to seeing more great papers on Emerging Technologies for Highly-Reliable Power Electronic Systems in Microelectronics International in the time yet to come and your continuous support of the journal.\",\"PeriodicalId\":49817,\"journal\":{\"name\":\"Microelectronics International\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2023-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics International\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/mi-07-2023-204\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-07-2023-204","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

电力电子变换器广泛用于为许多重要应用中的小型化电子设备供电,如通信基站、数据中心、可穿戴设备、智能家居和能量收集。然而,电力电子转换器经常受到机械,电气和热应力的影响,这有助于增加设备故障。考虑到失效元件可能导致意外中断和严重的安全问题,提高电力电子元件和电路的可靠性变得更加重要。《小型化电子器件中高可靠电力电子系统的新兴技术》特刊征文于2022年5月发表。我们共收到八份意见书。来自中国和欧洲的客座编辑迅速组织了评论。评审者被邀请来自世界各地。经过严格的审查,五篇论文被接受。这些被接受的论文都用创新的解决方案解决了一个特定的挑战。来自山东大学(威海)和北京交通大学的Y. Song及其合作者提出了一种改进的并联五电平回注电流源变换器,用于晶闸管变换器的自换流。仿真和实验结果验证了所提回喷电路驱动方法的有效性。中国矿业大学和郑州大学的F. Yang等人的论文提出了一种考虑不同热应力和容错能力的开关磁阻发电机可靠性分析方法。结果表明,相对于静态模型和单层马尔可夫模型,双层马尔可夫模型是最合适的。来自阿努拉格大学和K L大学的a . Sajja及其合著者的论文提出了一种带级联编码操作跨导放大器的斩波稳定放大器。总功耗为451 nW,供电电压为800mV。增益和共模抑制比分别为48 dB和78 dB。中国民航飞行大学的戴先生及其合著者提出了一种基于逻辑组合调制的三相级联h桥整流器直流端口电压平衡策略,无论面对无负载变化问题还是普通工作条件,都能可靠快速地工作。论文由H. Chen和他的合作者来自中国矿业大学、工程技术大学、圣彼得堡国立信息技术研究大学力学与光学、莫斯科国立研究大学动力工程学院、亚洲大学、西波美拉尼亚理工大学和圣彼得堡彼得大帝理工大学为提高开关磁阻发电机(srg)的效率,提出了一种功率变换器及其控制策略。结果表明,采用全桥功率变换器的SRG系统运行平稳,效率较高。我们感谢所有提交论文的作者的努力,我们感谢审稿人的及时审查,特别是在这个困难的时候。我们衷心感谢总编辑约翰·卡尔·阿特金森教授,感谢他在本期特刊的最后阶段给予我们的大力支持。最后,我们要感谢参与本期特刊制作和技术支持的微电子国际工作人员。我们期待在《微电子国际》杂志上看到更多关于高可靠性电力电子系统新兴技术的优秀论文,并期待您对该杂志的持续支持。
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Guest editorial: emerging technologies for highly-reliable power electronic systems in miniaturized electronic devices
Power electronic converters are widely used to power miniaturized electronic devices in many important applications, such as communication base stations, data centers, wearable devices, smart homes and energy harvesting. However, power electronic converters are often affected by mechanical, electrical and thermal stresses, which contributes to increased equipment failures. Considering failed components may cause unexpected interruptions and serious safety issues, it is becoming even more important to improve the reliability of power electronic components and circuits. The call for paper of the Special Issue on Emerging Technologies for Highly-Reliable Power Electronic Systems in Miniaturized Electronic Devices was published in May 2022. We received eight submissions in total. Reviews were promptly organized by Guest Editors fromChina and Europe. Reviewers are invited from all over the globe. After rigorous reviews, five papers were accepted. Each of these accepted papers addresses one particular challenge with innovative solutions. The paper by Y. Song and her coauthors from Shandong University (Weinhai) and Beijing Jiaotong University presents an improved parallel five-level reinjection current source converter for self-commutation of thyristor converter. The simulation and experimental results verify the effectiveness of the proposed reinjection circuit driving method. The paper by F. Yang and his coauthors from China University of Mining and Technology and Zhengzhou University proposes a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of switched reluctance generators. The results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model. The paper by A. Sajja and his coauthors from Anurag University and K L University presents a chopper-stabilized amplifier with a cascoded operational transconductance amplifier. The total power consumption is 451 nW with a supplied voltage of 800mV. The Gain and common mode rejection ratio are 48 dB and 78 dB, respectively. The paper by M. Dai and his coauthors from Civil Aviation Flight University of China presents a dc-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation, which can work reliably and quickly no matter facing the problem as load-removed change or the ordinary operating conditions. The paper by H. Chen and his coauthors from China University of Mining and Technology, University of Engineering and Technology, Saint Petersburg National Research University of Information Technologies Mechanics and Optics, National Research University Moscow Power Engineering Institute, Asian University, West Pomeranian University of Technology and Peter the Great St Petersburg Polytechnic University presents a power converter and its control strategy to improve the efficiency of switched reluctance generators (SRGs). The results show that the SRG system can keep smooth operation by the full-bridge power converter with relatively high efficiency. We appreciate the efforts from all authors who had submitted papers and we appreciate timely reviews from reviewers, especially at this time of difficulty. We would like to express our deep gratefulness to Prof John Karl Atkinson, Editor-in-Chief, for his tremendous support from the initiative throughout the final stages of this Special Issue. Finally, we would like to thank the Microelectronics International staff involved with the production and technical support of this Special Issue. We look forward to seeing more great papers on Emerging Technologies for Highly-Reliable Power Electronic Systems in Microelectronics International in the time yet to come and your continuous support of the journal.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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