{"title":"材料特性对热电材料等角多边形孔周围热应力的影响","authors":"M. Shen, Yi-Lun Liao, S. Tseng, C. Chao","doi":"10.1093/jom/ufad003","DOIUrl":null,"url":null,"abstract":"\n In this study, we conducted a theoretical analysis of thermal stress around an arbitrarily-shaped hole in a thermoelectric material under electric current density and energy flux loading. Based on complex variable methods, conformal mapping, and analytical continuation theorem, the exact solutions of the thermal stress around a hole were obtained for the Seebeck coefficient and electric and heat conductivity. Based on the conversion efficiency equation of thermoelectric materials, higher electrical conductivity, and lower heat conductivity should be selected to achieve an optimal design. The theoretical results indicated that higher electrical conductivity could reduce the thermal stress around the hole. However, energy flux and thermal stress concentration might be generated around the adiabatic hole due to the presence of a matrix with lower heat conductivity. Hence, thermoelectric materials with lower thermal conductivity should be selected carefully to avoid premature failure around the hole caused by thermal stress concentration. Finally, we also obtained and discussed the stress intensity factors of a hypocycloid-type crack.","PeriodicalId":50136,"journal":{"name":"Journal of Mechanics","volume":" ","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2023-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Material Characteristics on Thermal Stress around an Equiangular Polygonal Hole in a Thermoelectric Material\",\"authors\":\"M. Shen, Yi-Lun Liao, S. Tseng, C. Chao\",\"doi\":\"10.1093/jom/ufad003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n In this study, we conducted a theoretical analysis of thermal stress around an arbitrarily-shaped hole in a thermoelectric material under electric current density and energy flux loading. Based on complex variable methods, conformal mapping, and analytical continuation theorem, the exact solutions of the thermal stress around a hole were obtained for the Seebeck coefficient and electric and heat conductivity. Based on the conversion efficiency equation of thermoelectric materials, higher electrical conductivity, and lower heat conductivity should be selected to achieve an optimal design. The theoretical results indicated that higher electrical conductivity could reduce the thermal stress around the hole. However, energy flux and thermal stress concentration might be generated around the adiabatic hole due to the presence of a matrix with lower heat conductivity. Hence, thermoelectric materials with lower thermal conductivity should be selected carefully to avoid premature failure around the hole caused by thermal stress concentration. Finally, we also obtained and discussed the stress intensity factors of a hypocycloid-type crack.\",\"PeriodicalId\":50136,\"journal\":{\"name\":\"Journal of Mechanics\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.5000,\"publicationDate\":\"2023-03-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Mechanics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1093/jom/ufad003\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MECHANICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Mechanics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1093/jom/ufad003","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MECHANICS","Score":null,"Total":0}
Effects of Material Characteristics on Thermal Stress around an Equiangular Polygonal Hole in a Thermoelectric Material
In this study, we conducted a theoretical analysis of thermal stress around an arbitrarily-shaped hole in a thermoelectric material under electric current density and energy flux loading. Based on complex variable methods, conformal mapping, and analytical continuation theorem, the exact solutions of the thermal stress around a hole were obtained for the Seebeck coefficient and electric and heat conductivity. Based on the conversion efficiency equation of thermoelectric materials, higher electrical conductivity, and lower heat conductivity should be selected to achieve an optimal design. The theoretical results indicated that higher electrical conductivity could reduce the thermal stress around the hole. However, energy flux and thermal stress concentration might be generated around the adiabatic hole due to the presence of a matrix with lower heat conductivity. Hence, thermoelectric materials with lower thermal conductivity should be selected carefully to avoid premature failure around the hole caused by thermal stress concentration. Finally, we also obtained and discussed the stress intensity factors of a hypocycloid-type crack.
期刊介绍:
The objective of the Journal of Mechanics is to provide an international forum to foster exchange of ideas among mechanics communities in different parts of world. The Journal of Mechanics publishes original research in all fields of theoretical and applied mechanics. The Journal especially welcomes papers that are related to recent technological advances. The contributions, which may be analytical, experimental or numerical, should be of significance to the progress of mechanics. Papers which are merely illustrations of established principles and procedures will generally not be accepted. Reports that are of technical interest are published as short articles. Review articles are published only by invitation.