6H-SiC衬底干式CMP摩擦化学反应机理的研究

IF 2.4 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS Surface Engineering Pub Date : 2023-03-04 DOI:10.1080/02670844.2023.2223452
Z. Li, Zhichao Qi, Tian-Dong Zhang, Zhankui Wang, J. Su
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引用次数: 0

摘要

本文研究了6H-SiC基片与固体粉末的摩擦化学反应机理。白光干涉仪用于检测表面粗糙度,FESEM用于观察表面特性,EDS用于检测表面元素,XRD用于检测表面成分。根据检测结果分析了还原铁粉、无水碳酸钠和去离子水与6H-SiC的摩擦化学反应机理。研究发现,还原铁粉、无水碳酸钠和去离子水与6H-SiC表面反应形成了可去除的软界面过渡层。还原铁粉的去除率最高,为191 纳米 h–1.用无水碳酸钠抛光后,表面质量下降。研究结果为超精密加工领域提供了新的思路。
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Investigation of the tribochemical reaction mechanism in dry-type CMP of 6H-SiC substrate
ABSTRACT In this paper, the tribochemical reaction mechanism between solid powder and 6H-SiC substrate was investigated. White light interferometer was used to detect surface roughness, FESEM was used to observe surface characteristics, EDS was used to detect surface elements and XRD was used to detect surface components. The tribochemical reaction mechanism of the reduced iron powder, anhydrous sodium carbonate and deionized water with 6H-SiC was analysed by the detection results. It is found that the reduced iron powder, anhydrous sodium carbonate and deionized water react with the 6H-SiC surface to form a soft interfacial transition layer which can be removed. The removal rate of the reduced iron powder is the highest at 191 nm h–1. The surface quality decreases after polishing with the anhydrous sodium carbonate. The results of this study provide a new idea for the field of ultra-precision machining.
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来源期刊
Surface Engineering
Surface Engineering 工程技术-材料科学:膜
CiteScore
5.60
自引率
14.30%
发文量
51
审稿时长
2.3 months
期刊介绍: Surface Engineering provides a forum for the publication of refereed material on both the theory and practice of this important enabling technology, embracing science, technology and engineering. Coverage includes design, surface modification technologies and process control, and the characterisation and properties of the final system or component, including quality control and non-destructive examination.
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