SOI FinFET晶体管电热特性的数值研究

F. Nasri, Husien Salama
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引用次数: 0

摘要

本文研究了SOI FinFET晶体管的非傅立叶瞬态传热。校准漂移扩散(D-D)模型结合弹道扩散(BDE)模型作为电热模型用于预测准弹道状态下声子和电子的输运。采用有限元法进行了数值模拟。通过TCAD仿真和实验数据,发现所提出的数学公式能很好地反映传热特性和时间温度。另一方面,我们已经证明,在100 ns后,14 nm Bulk FinFET比14 nm SOI FinFET支持更好的温度分布。
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Numerical Investigation of the Electrothermal Properties of SOI FinFET Transistor
This paper investigates the non-Fourier transient heat transfer in an SOI FinFET transistor. The calibrated drift-diffusion (D-D) model in conjunction with the ballistic diffusive (BDE) model is used as an electrothermal model to predict phonon and electron transports in the quasi-ballistic regime. The finite element method has been employed to generate the numerical results. The proposed mathematical formulation was found to capture the transfer characteristics and the temporal temperature as given by TCAD simulation and experimental data. On the other hand, we have demonstrated that after 100 ns, the 14 nm Bulk FinFET supports better temperature distribution than the 14 nm SOI FinFET.
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来源期刊
International Journal of High Speed Electronics and Systems
International Journal of High Speed Electronics and Systems Engineering-Electrical and Electronic Engineering
CiteScore
0.60
自引率
0.00%
发文量
22
期刊介绍: Launched in 1990, the International Journal of High Speed Electronics and Systems (IJHSES) has served graduate students and those in R&D, managerial and marketing positions by giving state-of-the-art data, and the latest research trends. Its main charter is to promote engineering education by advancing interdisciplinary science between electronics and systems and to explore high speed technology in photonics and electronics. IJHSES, a quarterly journal, continues to feature a broad coverage of topics relating to high speed or high performance devices, circuits and systems.
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