毫米波无线集成系统:对未来解决方案的期望

Q4 Engineering Journal of Integrated Circuits and Systems Pub Date : 2022-09-17 DOI:10.29292/jics.v17i2.627

Ariana Lacorte Caniato Serrano, Gustavo Marcati, Igor Abe, Gustavo Palomino, G. Rehder

{"title":"毫米波无线集成系统:对未来解决方案的期望","authors":"Ariana Lacorte Caniato Serrano, Gustavo Marcati, Igor Abe, Gustavo Palomino, G. Rehder","doi":"10.29292/jics.v17i2.627","DOIUrl":null,"url":null,"abstract":"This paper intends to make a brief presentation of in integrated circuits’ developments and efforts towards new wireless applications at the millimeter-wave frequencies band. Considering low-cost applications for the consumer market, it is shown that using only one technology is not desirable for cost and size reasons. The 3D integration becomes a necessity for the new applications in such frequencies, pushing forward alternative technologies and new 3D interconnection techniques.","PeriodicalId":39974,"journal":{"name":"Journal of Integrated Circuits and Systems","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Millimeter-wave Wireless Integrated Systems: what to expect for future solutions\",\"authors\":\"Ariana Lacorte Caniato Serrano, Gustavo Marcati, Igor Abe, Gustavo Palomino, G. Rehder\",\"doi\":\"10.29292/jics.v17i2.627\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper intends to make a brief presentation of in integrated circuits’ developments and efforts towards new wireless applications at the millimeter-wave frequencies band. Considering low-cost applications for the consumer market, it is shown that using only one technology is not desirable for cost and size reasons. The 3D integration becomes a necessity for the new applications in such frequencies, pushing forward alternative technologies and new 3D interconnection techniques.\",\"PeriodicalId\":39974,\"journal\":{\"name\":\"Journal of Integrated Circuits and Systems\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Integrated Circuits and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.29292/jics.v17i2.627\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Integrated Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.29292/jics.v17i2.627","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}

引用次数: 0

摘要

本文简要介绍了集成电路在毫米波频段无线新应用方面的发展和努力。考虑到消费者市场的低成本应用，表明仅使用一种技术是不可取的，因为成本和尺寸的原因。3D集成成为这种频率下新应用的必要条件，推动了替代技术和新的3D互连技术的发展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Millimeter-wave Wireless Integrated Systems: what to expect for future solutions

This paper intends to make a brief presentation of in integrated circuits’ developments and efforts towards new wireless applications at the millimeter-wave frequencies band. Considering low-cost applications for the consumer market, it is shown that using only one technology is not desirable for cost and size reasons. The 3D integration becomes a necessity for the new applications in such frequencies, pushing forward alternative technologies and new 3D interconnection techniques.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Journal of Integrated Circuits and Systems Engineering-Electrical and Electronic Engineering

CiteScore

0.90

自引率

0.00%

发文量

期刊介绍： This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.