用缺陷多层石墨烯包覆银纳米粒子填充纳米包封热界面材料

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronic Engineering Pub Date : 2023-09-15 DOI:10.1016/j.mee.2023.112082
Sungjun Choi , Dongho Shin , Sarah EunKyung Kim , Changsun Yun , Yik Yee Tan , Caroline Sunyong Lee
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引用次数: 1

摘要

为了提高热界面材料(TIM)的导热系数,导热填料的选择至关重要。本研究选择缺陷石墨烯包覆银纳米粒子(Ag NPs)作为低电阻率的TIM填料。采用多元醇法制备了聚乙烯吡罗烷酮(PVP)包覆Ag NPs作为前驱体,采用化学气相沉积(CVD)法制备了厚度为95 nm的Ag NPs表面,形成了厚度为3 ~ 4 nm的多层石墨烯(MLG)包覆层。为了作为mlg包覆Ag NPs的金属TIM填料,研究了在CVD过程中加入不同比例PVP溶液对mlg包覆Ag NPs的热性能的影响。通过XRD分析,在26.207°处发现结晶碳峰,测得d-间距为3.40 Å。通过拉曼分析,D峰(1350 cm−1)、G峰(1590 cm−1)和2D峰(2850 cm−1)的存在证明了Ag NPs表面缺陷MLG的成功形成。最后,在CVD过程中,PVP包覆银NPs中加入60 wt%的PVP溶液,获得了71 W/(m∙K)的高导热系数,电阻率为6.0 × 10−8 Ω∙m,显示了mlg包覆银NPs之间的完全隔离,而PVP溶液添加量低于60 wt%并不能阻止银NPs粗化,从而提高了其电阻率。因此,获得了由缺陷mlg包覆的具有高导热系数的Ag NPs组成的纳米封装TIM填料,以证明其在热管理方面的高性能计算器件的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles

To increase the thermal conductivity of thermal interface materials (TIM), the selection of thermally conductive filler is crucial. In this study, defective graphene-coated silver nanoparticles (Ag NPs) were selected as TIM fillers with low electrical resistivity. Poly-vinylpyrrolidone (PVP) coated Ag NPs were fabricated by polyol process to be used as a precursor, while a multi-layer graphene (MLG) coated layer about 3–4 nm in thickness was formed on the surface of Ag NPs which is 95 nm through a chemical vapor deposition (CVD) process. For application as a metal TIM filler for MLG-coated Ag NPs, the thermal properties of MLG-coated Ag NPs with varying ratios of PVP solution added to the PVP-coated Ag NPs during CVD, were evaluated. Moreover, the peak for crystalline carbon was confirmed through XRD analysis at 26.207°, while the d-spacing was measured to be 3.40 Å. Through Raman analysis, the presence of D peak (1350 cm−1), G peak (1590 cm−1), and 2D peak (2850 cm−1) proved the successful formation of defective MLG on the surface of Ag NPs. Finally, high thermal conductivity of 71 W/(m∙K) with electrical resistivity of 6.0 × 10−8 Ω∙m was obtained when adding 60 wt% PVP solution to PVP-coated Ag NPs during CVD, showing complete isolation among MLG-coated Ag NPs while PVP solution added less than 60 wt% did not prevent Ag NPs from coarsening, increasing its electrical resistivity. Therefore, nano-capsuled TIM fillers composed of defective MLG-coated Ag NPs with high thermal conductivities were obtained to demonstrate their potential for high-performance computing devices in thermal management.

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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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