混合集成芯片级激光系统

IF 5.4 1区 物理与天体物理 Q1 OPTICS APL Photonics Pub Date : 2023-08-01 DOI:10.1063/5.0159527
C. Porter, S. Zeng, X. Zhao, L. Zhu
{"title":"混合集成芯片级激光系统","authors":"C. Porter, S. Zeng, X. Zhao, L. Zhu","doi":"10.1063/5.0159527","DOIUrl":null,"url":null,"abstract":"Photonic integrated circuits (PICs) allow for the rapid advancement of a wide range of optical devices on a compact platform, making them more useful and readily available in the commercial market. Various materials such as III–V semiconductors, silicon, silicon nitride, lithium niobate, and polymers are used to create PICs with certain unique properties. Hybrid integration can combine multiple material platforms via optical coupling and realize multi-functional PICs that overcome the limitations of a single material platform. This allows for a broad application base for hybrid integrated PICs, greatly enhancing their usability and practicality. In this paper, we will discuss the methodology and applications of hybrid integration for chip-scale laser systems, including narrow linewidth, widely tunable external cavity lasers, laser beam combining, integrated frequency combs, and integrated Pockels lasers.","PeriodicalId":8198,"journal":{"name":"APL Photonics","volume":" ","pages":""},"PeriodicalIF":5.4000,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Hybrid integrated chip-scale laser systems\",\"authors\":\"C. Porter, S. Zeng, X. Zhao, L. Zhu\",\"doi\":\"10.1063/5.0159527\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Photonic integrated circuits (PICs) allow for the rapid advancement of a wide range of optical devices on a compact platform, making them more useful and readily available in the commercial market. Various materials such as III–V semiconductors, silicon, silicon nitride, lithium niobate, and polymers are used to create PICs with certain unique properties. Hybrid integration can combine multiple material platforms via optical coupling and realize multi-functional PICs that overcome the limitations of a single material platform. This allows for a broad application base for hybrid integrated PICs, greatly enhancing their usability and practicality. In this paper, we will discuss the methodology and applications of hybrid integration for chip-scale laser systems, including narrow linewidth, widely tunable external cavity lasers, laser beam combining, integrated frequency combs, and integrated Pockels lasers.\",\"PeriodicalId\":8198,\"journal\":{\"name\":\"APL Photonics\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":5.4000,\"publicationDate\":\"2023-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"APL Photonics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.1063/5.0159527\",\"RegionNum\":1,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"APL Photonics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1063/5.0159527","RegionNum":1,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"OPTICS","Score":null,"Total":0}
引用次数: 2

摘要

光子集成电路(PIC)允许在紧凑的平台上快速发展各种光学设备,使其在商业市场上更有用、更容易获得。各种材料,如III–V半导体、硅、氮化硅、铌酸锂和聚合物,用于制造具有某些独特性能的PIC。混合集成可以通过光学耦合将多个材料平台组合在一起,实现多功能PIC,克服单个材料平台的局限性。这为混合集成PIC提供了广泛的应用基础,大大提高了其可用性和实用性。在本文中,我们将讨论芯片级激光系统的混合集成方法和应用,包括窄线宽、可广泛调谐的外腔激光器、激光束组合、集成频率梳和集成波克尔激光器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Hybrid integrated chip-scale laser systems
Photonic integrated circuits (PICs) allow for the rapid advancement of a wide range of optical devices on a compact platform, making them more useful and readily available in the commercial market. Various materials such as III–V semiconductors, silicon, silicon nitride, lithium niobate, and polymers are used to create PICs with certain unique properties. Hybrid integration can combine multiple material platforms via optical coupling and realize multi-functional PICs that overcome the limitations of a single material platform. This allows for a broad application base for hybrid integrated PICs, greatly enhancing their usability and practicality. In this paper, we will discuss the methodology and applications of hybrid integration for chip-scale laser systems, including narrow linewidth, widely tunable external cavity lasers, laser beam combining, integrated frequency combs, and integrated Pockels lasers.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
APL Photonics
APL Photonics Physics and Astronomy-Atomic and Molecular Physics, and Optics
CiteScore
10.30
自引率
3.60%
发文量
107
审稿时长
19 weeks
期刊介绍: APL Photonics is the new dedicated home for open access multidisciplinary research from and for the photonics community. The journal publishes fundamental and applied results that significantly advance the knowledge in photonics across physics, chemistry, biology and materials science.
期刊最新文献
Impact of polarization pulling on optimal spectrometer design for stimulated Brillouin scattering microscopy. Deep-ultraviolet Fourier ptychography (DUV-FP) for label-free biochemical imaging via feature-domain optimization. Generation of entangled photon pairs from a silicon bichromatic photonic crystal cavity A liquid crystal-based multi-bit terahertz reconfigurable intelligent surface Topological photonics in three and higher dimensions
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1