Numerical investigation of graphene-silica-silver based VLSI interconnects with tunable multiband infrared absorber for 3D integrated circuits

Abstract. We propose the multilayer silver-silica-graphene-based very large-scale integration interconnects assisted by a tunable perfect absorption structure over the infrared frequency spectrum of the third window of the optical communication for three-dimensional (3D) integrated circuits (ICs). This absorber is numerically investigated for the different cylindrical silver resonator-based squared geometries. The overall structure is investigated for the wavelength range of 1.4 to 1.6  μm over the infrared spectrum. The adjustable behavior of the absorption spectrum is observed when this structure is studied for various chemical potentials of the graphene sheet. We also present the electric and magnetic field intensity for the nearly perfect absorption conditions to identify the effect of energy concentration over different pixel structures and wavelengths. We also showcased the possible fabrication process for the proposed numerical investigation analysis. Resonator height and width have also been simulated numerically to find the resonance shift in the absorber. The adaptable behavior of the suggested structure has potential applications in a wide range of scientific fields, including biosensors, solar absorbers, optical communication, and the fabrication of 3D ICs. Simulations are performed using the COMSOL Multiphysics software module