{"title":"离子液体稳定金属纳米粒子制备导电浆料及其烧结效果","authors":"Tae-Gyun Kwon, Younghoon Kim","doi":"10.1007/s13391-023-00451-2","DOIUrl":null,"url":null,"abstract":"<div><p>Conductive paste inks have received considerable attention as facile conductive materials for the formation of electrode layers. However, conventional paste inks result in films with poor surface morphology. In addition, they require a high thermal annealing temperature for achieving high electrical conductivity because of their organic/inorganic composite structure, in which nanosized metal particles and polymeric organic binders are mixed in solvents. In this work, we prepare solvent-free and polymeric-binder-free metal nanoparticle (NP) fluids, which can be used as facile conductive pastes for forming an electrode layer after sintering at a considerably low temperature. We employ thiol-terminated imidazolium-type ionic liquid (IL-SH) molecules with a small molecular weight and fluidic behavior as the surface ligands of Ag NPs. IL-SH-stabilized Ag NPs exhibit fluidic behavior and metallic conducting properties at a considerably low sintering temperature of 250 °C.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":536,"journal":{"name":"Electronic Materials Letters","volume":"20 3","pages":"337 - 344"},"PeriodicalIF":2.1000,"publicationDate":"2023-08-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Conductive Paste Inks Prepared Using Ionic-Liquid-Stabilized Metal Nanoparticle Fluids and their Sintering Effect\",\"authors\":\"Tae-Gyun Kwon, Younghoon Kim\",\"doi\":\"10.1007/s13391-023-00451-2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Conductive paste inks have received considerable attention as facile conductive materials for the formation of electrode layers. However, conventional paste inks result in films with poor surface morphology. In addition, they require a high thermal annealing temperature for achieving high electrical conductivity because of their organic/inorganic composite structure, in which nanosized metal particles and polymeric organic binders are mixed in solvents. In this work, we prepare solvent-free and polymeric-binder-free metal nanoparticle (NP) fluids, which can be used as facile conductive pastes for forming an electrode layer after sintering at a considerably low temperature. We employ thiol-terminated imidazolium-type ionic liquid (IL-SH) molecules with a small molecular weight and fluidic behavior as the surface ligands of Ag NPs. IL-SH-stabilized Ag NPs exhibit fluidic behavior and metallic conducting properties at a considerably low sintering temperature of 250 °C.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":536,\"journal\":{\"name\":\"Electronic Materials Letters\",\"volume\":\"20 3\",\"pages\":\"337 - 344\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2023-08-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electronic Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s13391-023-00451-2\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s13391-023-00451-2","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Conductive Paste Inks Prepared Using Ionic-Liquid-Stabilized Metal Nanoparticle Fluids and their Sintering Effect
Conductive paste inks have received considerable attention as facile conductive materials for the formation of electrode layers. However, conventional paste inks result in films with poor surface morphology. In addition, they require a high thermal annealing temperature for achieving high electrical conductivity because of their organic/inorganic composite structure, in which nanosized metal particles and polymeric organic binders are mixed in solvents. In this work, we prepare solvent-free and polymeric-binder-free metal nanoparticle (NP) fluids, which can be used as facile conductive pastes for forming an electrode layer after sintering at a considerably low temperature. We employ thiol-terminated imidazolium-type ionic liquid (IL-SH) molecules with a small molecular weight and fluidic behavior as the surface ligands of Ag NPs. IL-SH-stabilized Ag NPs exhibit fluidic behavior and metallic conducting properties at a considerably low sintering temperature of 250 °C.
期刊介绍：
Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.
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