基于AlGaN/GaN异质结构的三维力传感器

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Micro and Nano Engineering Pub Date : 2023-06-01 DOI:10.1016/j.mne.2023.100198
Péter Lajos Neumann , János Radó , János Márk Bozorádi , János Volk
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引用次数: 1

摘要

触觉传感是传感技术中必不可少的物理电气网关。如果目标是再现类似人类的感觉,那么制造这样的传感器是一项复杂的挑战。典型环境条件下的经典MEMS触觉传感器解决方案类型不多,但空间技术或高温范围等恶劣条件尚未解决。一种提出的材料复合体是GaN/AlGaN系统。在本研究中,我们提出了一种AlGaN/GaN MEMS力传感器,用于mN范围内的外力和负载方向传感。所展示的传感器显示出100mV/N/V的灵敏度,这比具有相同几何形状的硅基传感器高一个数量级。传感机制基于化合物合金层之间的界面不连续性,其中产生二维电子气(2DEG),并且其中载流子浓度可以由内部晶体应力线性调制。通过有限元模拟对传感元件的位置进行了优化。样品的最大负载力随方向而变化,该信息允许传感器在没有疲劳的情况下使用,并在不同的外部张力下获得安全的电响应信号。除了这种设计在恶劣环境下的优点之外,还可以单片集成与传感器相邻的有源元件,用于测量信号的局部采集和处理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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AlGaN/GaN heterostructure based 3-dimensional force sensors

Tactile sensing is an essential physical-electrical gateway in sensing technology. Creating such sensors is a complex challenge if the goal is to reproduce human-like sensation. Classical MEMS tactile sensor solutions in typical environmental conditions exist few types, but harsh conditions such as space technology or high-temperature range are not solved yet. One proposed material complex is the GaN/AlGaN system. In this study, we present an AlGaN/GaN MEMS force sensor for external force and load direction sensing in the mN range. The demonstrated sensor showed a sensitivity of 100 mV/N/V, which is an order of magnitude higher than the Si-based sensor with the same geometry. The sensing mechanism is based on the interface discontinuity between compound alloy layers, where two-dimensional electron gas (2DEG) is created and in which the carrier concentration can be linearly modulated by the internal crystal stress. The location of the sensing element was optimized by FEM simulation. The maximum load force of the samples varies with direction, which information allows the sensor to be used without fatigue and to obtain safety an electrical response signal under different external tensions. In addition to the advantage of this design for harsh environments, it is also possible to monolithically integrate active elements adjacent to the sensor for local acquisition and processing of the measured signal.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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